Patent
Heat sink apparatus
TLDR
In this paper, an improved heat sink is proposed that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to different or higher temperature stage or condition of energy.Abstract:
An improved heat sink apparatus that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to a different or higher temperature stage or condition of energy. The apparatus includes a thermally conductive base plate, a plurality of thick corrugated finned assembly components constructed and arranged in abutting relationship and offset from each other so as to cause a circuitous path of fluid flow therethrough. The apparatus also may include the base plate and a plurality of thick, sawtooth shaped, or segmented fins mounted thereon. The length of fluid travel from one finned component to an abutting finned component along the heat transfer surface is controlled in order to prevent development of thermal boundary layer on the inner surface of the finned assembly components.read more
Citations
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References
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Patent
Finned heat sink and method of manufacture
TL;DR: In this article, a finned heat sink is constructed from a base having parallel grooves with a latching lip, and the fin is individually formed with a retaining boss adjacent one edge which is adapted to mate with the lip to secure the fin in the groove.
Patent
Forced air heat sink apparatus
TL;DR: In this paper, a high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures.
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Lsi cooling apparatus and computer cooling apparatus
Toshio Hatada,Hitoshi Matsushima,Yoshihiro Kondo,Hiroshi Inoue,Otsuka Kanji,Yuji Shirai,Takao Ohba,Akira Yamagiwa +7 more
TL;DR: In this article, a heat sink is constructed to be small in pressure loss and excellent in cooling performance, where the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40.
Patent
Dimpled heat transfer surface and method of making same
TL;DR: In this paper, a dimpled heat transfer surface for transferring heat energy from either a hot fluid or hot object to a cooler fluid, and method of making same is described, where at least one plate is used to transfer heat from the hot fluid on one side of the plate to the cool fluid on the other side of a plate, and a plurality of intact spaced depression is created by the plate, which increases both the heat transfer film coefficient and the heat energy being transferred.
Patent
Heat dissipator for integrated circuit
Wilens Seymour,G. Trunk Edmund +1 more
TL;DR: In this paper, a heat dissipator for a semiconductor component of the type having L-shaped heat conductive tabs extending therefrom comprising a stamped sheet metal body having two pairs of oppositely facing fingers struck from said sheet metal and bent out of the plane thereof.