Yoshimasa Ohshima

TL;DR: In this article, a defect inspection method using a slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of movement of the substrate.

TL;DR: In this article, a small-sized inspection apparatus is used for real-time inspection of the foreign particles on the wafers of a semiconductor manufacturing process. But this is not suitable for the use of large quantities of defects and for keeping a necessary yield.

TL;DR: In this paper, a mass production off-line system including an apparatus for detecting, analyzing and evaluating the content of foreign matters during the mass production start-up is separated from the production line and installed independently thereof.

TL;DR: In this article, a method of and apparatus for detecting a foreign substance on an object by illuminating said object, detecting via an optical system light reflected from said object and detecting said foreign substance in distinction from a background.

TL;DR: In this article, a defect inspecting apparatus and a defect inspection method for inspecting an object of inspection for a defect such as a foreign particle existing on the object, where, by using a high-efficiency illumination optical system for radiating an illumination beam to the object of the inspection from a direction to reduce the intensity of a scattered light generated by a pattern on the objects of inspection, it is possible to decrease the intensity from the pattern which causes a variation of a signal.