Z
Zhanglei Du
Researcher at Jilin University
Publications - 6
Citations - 113
Zhanglei Du is an academic researcher from Jilin University. The author has contributed to research in topics: Adhesive & Aqueous solution. The author has an hindex of 4, co-authored 6 publications receiving 68 citations.
Papers
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Journal ArticleDOI
Bringing Hetero-Polyacid-Based Underwater Adhesive as Printable Cathode Coating for Self-Powered Electrochromic Aqueous Batteries
Journal ArticleDOI
Coassembly of Short Peptide and Polyoxometalate into Complex Coacervate Adapted for pH and Metal Ion-Triggered Underwater Adhesion.
TL;DR: Rheological measurements demonstrate that the adhesive coacervates exhibit shear thinning behavior, which allows them to be conveniently delivered for interfacial spreading through a narrow gauge syringe without high pressure, and the adhesion strength of the peptide-based gel is quantified by lap shear mechanical analysis.
Journal ArticleDOI
Light-powered and transient peptide two-dimensional assembly driven by trans-to-cis isomerization of azobenzene side chains.
TL;DR: Two-dimensional nanostructures are fabricated based on the ionic self-assembly of anionic polyoxometalates and cationic peptides appended with azobenzene side chains through ultraviolet (UV) light-actuated trans-to-cis isomerization of azOBenzene moieties.
Journal ArticleDOI
Aqueous self-assembly of arginine and K8SiW11O39: fine-tuning the formation of a coacervate intended for sprayable anticorrosive coatings.
TL;DR: It is demonstrated that the coacervate could be tuned by stoichiometry and pH, and a phase diagram for the complexation of Arg and SiW11 thus has been constructed using turbidity measurements.
Patent
Composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and preparation method of composite water-based conductive adhesive
TL;DR: In this paper, a composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and a preparation method of the composite water based conductive adhesive is presented.