A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.

Printed wiring board

A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.

Multilayer printed wiring board

The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

Multilayer printed wiring board with filled viahole structure

A multilayer printed wiring board having a filled-via structure, advantageous to form a fine circuit pattern and excellent in the resistances to cracking in heat cycles and to thermal shock. Conductor circuits and resin insulating layers are alternately formed in multilayer, via holes are formed in the interlayer insulating resin layer, the surface of a plating layer exposed in the opening part of each via hole is flat and substantially flush with the surface of the conductor circuit, the thickness of the conductor circuit is less than half the diameter of the via holes, the inner wall of the opening part of the interlayer insulating resin layer is roughened, an electroless plating film is formed over the roughened wall surfaces, and each via hole is filled with an electroplating material, thus completing the via holes. The insulating resin of the interlayer resin insulating layer is a composite material of a fluorocarbon resin having an excellent fracture toughness and a heat-resistant thermoplastic resin, a composite material of a fluorocarbon resin and a thermosetting resin, or a composite material of a thermosetting resin and a heat-resistant thermoplastic resin.

Multilayer printed wiring board having filled-via structure

The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.

Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board

PROBLEM TO BE SOLVED: To thin the line width of wiring conductors and besides, make the diameter of through holes small, and wiring conductors above and below in high density, by forming organic resin insulating layers out of acid catalyst type photosensitive epoxy resin SOLUTION: For an insulating substrate 1, a multilayer wiring consisting of an organic resin insulating layer 2 and a film wiring conductor 3 is arranged on the topside, and it works as a support member to support the multilayer wiring 4 Then, the organic resin insulating layer 2 of the multilayer wiring 4 consists of acid catalyst type of photosensitive epoxy resin, and paste-form acid catalyst type of photosensitive epoxy resin precursor is obtained by adding and mixing, for example, phenol novolak resin, etc, and also the acid catalyst type of photosensitive resin precursor is stuck in specified thickness to the top of the insulating substrate 1 by spin coating method or the like, and next this is exposed and developed to form a hole to serve as a through hole 5, and then, this is heated for 30-60min at a temperature of 180 degC, and it is hardened completely, thus this is made

Multilayer wiring board

PROBLEM TO BE SOLVED: To provide a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and provide a manufacturing method of the same. SOLUTION: In a wiring board, a connecting pad 2a (2b) comprising copper is formed on the surface of an insulating substrate having a wiring conductor, and the surface of the connecting pad 2a (2b) is successively coated with an electroless nickel plating film 11, a reduction type electroless palladium plating film 12 and a substitutional reduction type electroless gold plating film 13. There is provided also a manufacturing method of the same. COPYRIGHT: (C)2007,JPO&INPIT

Wiring board and manufacturing method of the same

PROBLEM TO BE SOLVED: To form the diameter of a through-hole precisely in a specific dimen sion by a method wherein the thickness of a thin film wiring conductor is speci fied to exceed 1/2 of the through-hole diameter provided in an organic resin insulating layer also a through-hole is completely filled up with a through-hole conductor. SOLUTION: The thickness of a thin film conductor 3 is specified to exceed 1/2 or a through-hole diameter provided in an organic resin insulating layer 2. Thus, in the case of coating the surface of the organic resin insulating layer 2 with the thin film wiring conductor 3, the through-hole 5 is filled up with a part of the thin film wiring conductor 3 so as to be completely buried in the through-hole 5. Resultantly, in the case of making multulayer wiring by alternately laminating the organic resin layer 2 and the thin film wiring conductor 3, the formation of a stepped part due to the through-hole 5 provided on the organic resin insulating layer 2 arranged beneath the surface of the organic resin insulating film 2 arranged on the upper part can be avoided.

Multilayer wiring board and its manufacturing method

PROBLEM TO BE SOLVED: To provide a wiring board in which the electrode of a semiconductor integrated circuit element and a conductor pillar can be connected rigidly and three-dimensionally through solder, a sufficient interval can be kept between the lower surface of the semiconductor integrated circuit element and the upper surface of the wiring board even if the volume of solder joining them is small, and the gap therebetween can be filled well with sealing resin, and to provide a method of manufacturing the same.SOLUTION: The wiring board 50 comprises a semiconductor element connection pad 10 formed on the upper surface of an insulating substrate 3, a conductor pillar 11 formed on the semiconductor element connection pad 10, and a solder resist layer 6 applied on the upper surface of the insulating substrate 3 with a thickness thinner than that of the conductor pillar 11 to cover the outer periphery of the semiconductor element connection pad 10 and has an opening 6a which exposes the side surface of the conductor pillar 11.

Wiring board and method of manufacturing the same

PROBLEM TO BE SOLVED: To provide a gene analysis wiring board in which the elution of copper ions into the inside of detection recesses is reduced and the used amount of gold is suppressed.SOLUTION: A gene analysis wiring board comprises: an upper-side conductor layer 8 formed of a copper plating layer, deposited on an upper surface of an insulation board 3, including detection electrodes 9 for gene analysis; a lower-side conductor layer 8 formed of a copper plating layer deposited on a lower surface of the insulation board 3; an upper-side solder resist layer 11 having openings 12 to expose the upper surface center parts of the detection electrodes 9; and a lower-side solder resist layer 11 to expose a part of the lower-side conductor layer 8. The upper-side conductor layer 8 is clad with a gold plating layer 14 throughout its surface covered with the solder resist layer 11 and its surface exposed from the solder resist layer 11. The lower-side conductor layer 8 is clad with the gold plating layer 14 only throughout its surface exposed from the solder resist layer 11.

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Papers

Multilayer wiring board

Wiring board and manufacturing method of the same

Multilayer wiring board and its manufacturing method

Wiring board and method of manufacturing the same

Gene analysis wiring board and manufacturing method for the same

征一 高見

Papers

Multilayer wiring board

Wiring board and manufacturing method of the same

Multilayer wiring board and its manufacturing method

Wiring board and method of manufacturing the same

Gene analysis wiring board and manufacturing method for the same

征一高見