Patent
Wiring board and manufacturing method of the same
TLDR
In this paper, the problem of providing a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and providing a manufacturing method of the same, is addressed.Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and provide a manufacturing method of the same. SOLUTION: In a wiring board, a connecting pad 2a (2b) comprising copper is formed on the surface of an insulating substrate having a wiring conductor, and the surface of the connecting pad 2a (2b) is successively coated with an electroless nickel plating film 11, a reduction type electroless palladium plating film 12 and a substitutional reduction type electroless gold plating film 13. There is provided also a manufacturing method of the same. COPYRIGHT: (C)2007,JPO&INPITread more
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Patent
Printed circuit board and method for manufacturing the same
TL;DR: In this paper, a printed circuit board with a core insulating layer, at least one via formed through the core layer, an inner circuit layer buried in the core, and an outer circuit layer on a top surface or a bottom surface of the core is described, wherein the via includes a first part, a second part below the first part and a third part between the first and second parts.
Patent
Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
TL;DR: In this article, the connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating material which is a displacement or electroless palladium material with a purity of at least 90% by mass and less than 99% bymass, and a displacement gold material.
Patent
Electroless gold-plating method and electronic component
Masayuki Kiso,Seigo Kurosaka,Yukinori Oda,Toru Okada,Ayumi Okubo,阿弓 大久保,幸典 小田,亨 岡田,雅之 木曽,成吾 黒坂 +9 more
TL;DR: In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.
Patent
Electroless gold plating method and electronic parts
TL;DR: In this article, an electroless gold plating bath is used to form a plated laminate with a thickness of not smaller than 0.15 μm, which can be used for wire bonding or wire bonding.
Patent
Circuit Board Having a Plurality of Circuit Board Layers Arranged One Over the Other Having Bare Die Mounting for Use as a Gearbox Controller
TL;DR: In this article, a control unit for vehicle applications having at least one circuit board is described, where the circuit board layers are each made of a base material, the glass transition temperature of which is greater than or equal to 170 °C.
References
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Patent
Electroless gold plating liquid
TL;DR: In this article, the electroless gold plating liquid A and 6-ethoxy-2 mercaptobenzothiazole is added to the soln and there is no formation of the gold precipitate for two days without addition there of after prepn. in assessed.
Patent
Substrate for mounting semiconductor and its production
TL;DR: In this paper, a substrate for mounting the semiconductors is constituted by forming an electroless nickel plating film on circuits consisting of metals, forming a electroless palladium plating on the electroless nithophosphorus alloy plating, and forming an electrical gold plating (EPGP) on the EPHP plating.
Patent
Electroless palladium plating solution and plating method
TL;DR: In this article, an inorganic sulfur compound is added into the electroless palladium plating solution containing the palladium compound, the reducing agent and the complexing agent to improve plating bath stability.
Patent
Printed-wiring board
TL;DR: In this paper, the problem of providing a printed-wiring board having bonding performance excellent in heat resistance even in a thin substitution type Au plating layer was addressed, where a non-electrolytic layer of electrolytic plating was provided with a thickness of 0.03-2μm as for the underneath Pd-Ni plating.
Patent
Wire bonding terminal, its manufacture and manufacture of semiconductor loading substrate using wire bonding terminal
TL;DR: In this paper, the problem of preventing wire bonding from being interrupted even if thermal treatment is executed by forming an electroless nickel alloy coat, a substitution palladium plating coat, or the electroless palladium plated coat or electroless plated coating on the surface of copper in a terminal form.