The invention relates to the technical field of heat dissipation, in particular to a radiator for a high-voltage transformer oil tank and a power module. The radiator comprises a base plate and a copper pipe. The surface of the base plate is provided with a bent groove. The copper pipe is embedded in the groove. The gap where the groove makes contact with the copper pipe is filled with high thermal conductivity materials. The surface, opposite to the surface provided with the groove, of the radiator is tightly attached to the transformer oil tank. The power module is mounted on the copper pipe. Since the high-voltage transformer oil tank and the power module adopt the same radiator for heat dissipation, only one liquid path is needed for being connected with a cooling liquid, liquid path connection connectors are reduced, and the situation that the liquid is leaked from the liquid path to burn out a power supply is prevented. No water flows in the oil tank, and therefore the situation that water enters the high-voltage transformer oil tank to burn out a high-voltage transformer is prevented.

Radiator for high-voltage transformer oil tank and power module

The present utility model discloses a cooling device of a large-power electronic component. The device comprises a heat dissipation plate, and an M-shaped cooling pipe arranged on the heat dissipation plate; the large-power electronic component is arranged on the heat dissipation plate, and the large-power electronic component is arranged above the cooling pipe. The cooling device of the large-power electronic component has good heat dissipation effects, the problem of electronic component failure caused by insufficient sealing of the cooling device can be overcome, the cooling pipe can be used for enabling cooling liquid to separate from the heat dissipation plate; thus the heat dissipation plate is protected by the cooling pipe, the heat dissipation plate can be prevented from being corroded by the cooling liquid during the long-term using process, the service life of the cooling device can be enhanced; the cooling pipe and the heat dissipation plate adopted in the cooling device are high in structure reliability, and the working reliability of the cooling device is high.

Zichun Feng

Papers

Cooling device of large-power electronic component