Cooling device of large-power electronic component

TLDR: In this paper, a cooling device of a large-power electronic component is described, and an M-shaped cooling pipe is used to separate cooling liquid from the heat dissipation plate.

Abstract: The present utility model discloses a cooling device of a large-power electronic component. The device comprises a heat dissipation plate, and an M-shaped cooling pipe arranged on the heat dissipation plate; the large-power electronic component is arranged on the heat dissipation plate, and the large-power electronic component is arranged above the cooling pipe. The cooling device of the large-power electronic component has good heat dissipation effects, the problem of electronic component failure caused by insufficient sealing of the cooling device can be overcome, the cooling pipe can be used for enabling cooling liquid to separate from the heat dissipation plate; thus the heat dissipation plate is protected by the cooling pipe, the heat dissipation plate can be prevented from being corroded by the cooling liquid during the long-term using process, the service life of the cooling device can be enhanced; the cooling pipe and the heat dissipation plate adopted in the cooling device are high in structure reliability, and the working reliability of the cooling device is high.