Patent
Activation process for electroless nickel plating
TLDR
A SILICON SURFACE is prepared for ELECTROLESS NICKEL PLATING by ACTIVATION with an AQUEOUS HYDROFLUORIC ACID Solution CONTAINING from 1 E to 1 HUNDRED P.M. of Ionic gold as mentioned in this paper.Abstract:
A SILICON SURFACE IS PREPARED FOR ELECTROLESS NICKEL PLATING BY ACTIVATION WITH AN AQUEOUS HYDROFLUORIC ACID SOLUTION CONTAINING FROM ONE E TO ONE HUNDRED P.P.M. OF IONIC GOLD. SUBSEQUENT ELECTROLESS DEPOSITION OF NICKEL PROCEEDS MORE UNIFORMLY OVER THE ENTIRE SILICON SURFACE, AND RESULTS IN A MORE STABLE, TIGHTLY ADHERING NICKEL PLATE DUE TO THE IMPROVED ACTIVATION STEP. ADDITIONAL STABILITY AND EVEN MORE RELIABLE ADHESION IS OBTAINED BY A SUBSEQUENT SINTERING OF THE COMPOSITE STRUCTURE ABOVE THE GOLD-SILICON EUTECTIC TEMPERATURE TO ALLOY THE GOLD ACTIVATION FILM WITH THE SILICON. THE SINTERING STEP ISS THEN PREFERABLY FOLLOWED BY A SECOND ELECTROLESS NICKEL PLATING STEP TO BUILD A NICKEL CONTACT AREA OF INCREASED THICKNESS.read more
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