Patent
Apparatus and methods for constructing antennas using wire bonds as radiating elements
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TLDR
In this article, wire bonding methods can be used to attach and form loop profiles for the wires of an antenna, which can be integrally packaged with IC chips to build integrated wireless or RF (radio frequency) communications systems.Abstract:
Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires The antennas can be integrally packaged with IC chips (eg, IC transceivers, receivers, transmitters, etc) to build integrated wireless or RF (radio frequency) communications systems For example, an exemplary antenna device (20) comprises a substrate (21) having a dipole antenna comprising a first wire element (22) connected to and supported by metallic pads (23) and (24), and a second wire element (25) connected to and supported by metallic pads (26) and (27) The metallic pads (23) and (26) are contact pads to an integrated antenna feed network connected to an RF circuit, for example The metallic pads (24) and (27) are termination pads for attaching and supporting the end (non-fed) portions of respective wire elements (22) and (25) Optional metallic shielding elements (28) and (29) are formed on the substrate/chip (21) under respective wire elements (22) and (25) to prevent electromagnetic fields from penetrating into the substrate (21) thereby reducing loss and improving the antenna efficiencyread more
Citations
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Patent
Method and apparatus for coupling an antenna to a device
Paul Shala Henry,Donald J. Barnickel,Farhad Barzegar,Robert Bennett,Irwin Gerszberg,Thomas M. Willis +5 more
TL;DR: In this paper, the authors describe a system that receives, by a feed point of a dielectric antenna, electromagnetic waves from a core coupled to the feed point without an electrical return path, and radiates a wireless signal responsive to the electromagnetic waves being received at the aperture.
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TL;DR: In this paper, a distributed antenna and backhaul system provide network connectivity for a small cell deployment using high-bandwidth, millimeter-wave communications and existing power line infrastructure, rather than building new structures, and installing additional fiber and cable.
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Paul Shala Henry,Robert Bennett,Irwin Gerszberg,Farhad Barzegar,Donald J. Barnickel,Thomas M. Willis +5 more
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References
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Patent
Radio frequency identification tag
Michael John Brady,Thomas Anthony Cofino,Harley Kent Heinrich,Glen Walden Johnson,Paul A. Moskowitz,George Frederick Walker +5 more
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TL;DR: In this paper, an integrated circuit package consisting of at least one substrate, each substrate including at least 1 layer, one semiconductor die, one terminal, and an antenna is presented.
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TL;DR: In this paper, a first antenna coil (22) is formed on a surface of an IC chip (23), a second coil (31) and a third coil (32) are formed on the module board (30).
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Michael John Brady,Cofino Thomas,Harley Kent Heinrich,Glen Walden Johnson,Paul Andrew Moskowitz,George Frederick Walker +5 more
TL;DR: In this paper, a radio frequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate, is presented, which can be used by the chip to modulate an incident RF signal to transfer information to a base station.