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Patent

Apparatus, method, and process with laser induced channel edge

TLDR
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and an edge extending around at least a portion of a perimeter of the transparent substrate, wherein the edge being a laser induced channel edge having enhanced edge characteristics is described in this article.
Abstract
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and edge extending around at least a portion of a perimeter of the substantially transparent substrate, wherein the edge being a laser induced channel edge having enhanced edge characteristics.

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Citations
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Patent

Method and apparatus for performing laser filamentation within transparent materials

TL;DR: In this paper, a burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament.
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Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses

TL;DR: In this paper, a laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength and the laser beam passes through a distributive lens focusing assembly and to the Kerr material.
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Laser cutting strengthened glass

TL;DR: In this article, the methods for cutting strengthened glass are disclosed, which can include using a laser and an electrochromic film and can include chemically strengthened, heat strengthened, and heat tempered glass.
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Laser processing of slots and holes

TL;DR: In this paper, a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass, is described. But the method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
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Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses

TL;DR: In this paper, a spiral cut transparent tube using laser machining is presented, where a beam waist is formed external to the surface of the transparent tube, where the laser pulses and sufficient energy density are maintained within the tube to form a continuous laser filament therethrough without causing optical breakdown.
References
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Journal ArticleDOI

Observation of Self-Phase Modulation and Small-Scale Filaments in Crystals and Glasses

TL;DR: In this paper, small-scale filaments were observed in calcite, quartz, sodium chloride, and several glasses under picosecond pulse excitation, and the physical mechanism responsible for these processes is the change in refractive index resulting from electronic distortion.
Patent

Electrochromic mirrors and devices

TL;DR: In this paper, the present invention relates to electrochromic mirrors and devices whose electro-chromic element is composed of an electro chromic solid film and an electrolyte comprising redox reaction promoters and alkali ions and/or protons.
Patent

Electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films, and processes for making such solid films and devices

TL;DR: In this article, the electrochromic polymeric solid films of the present invention exhibit beneficial properties and characteristics, especially when compared to known electro chromic media, and they also perform well under prolonged coloration, outdoor weathering and all-climate exposure.
Patent

Method for controlling configuration of laser induced breakdown and ablation

TL;DR: In this article, the authors proposed a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable change in slope at a predetermined laser pulse width value.
Patent

Laser processing method and laser processing apparatus

TL;DR: In this article, the authors present a method for cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, where a pulse laser beam is radiated on the predetermined cut line, and a modified area is formed inside the work along the determined cut line by moving the condensed point along the predetermined cutoff point, whereby the work can be cut with a rather small force by starting from the modified area.