Patent
Catalyst solution for electroless metal deposition on a substrate
TLDR
In this article, the authors proposed a catalyst for activating a substrate prior to electroless metal plating and a process for making the same, which consists of the product resulting from the admixture of an acid soluble salt of a catalytic metal, stannous salt, an acid and an extraneous source of halide ions.Abstract:
The invention disclosed herein is a catalyst for activating a substrate prior to electroless metal plating and to a process for making the same. The catalyst comprises the product resulting from the admixture of an acid soluble salt of a catalytic metal, a stannous salt, an acid and an extraneous source of halide ions. The extraneous source of halide ions provides an excess of halide ions in the catalyst formulation over that found in prior art formulations. The catalyst differs from prior art catalysts in the excess of halide ions and is an improvement as it may be used at a higher pH to catalyze substrates normally attacked by strong acids, is more stable and is adsorbed onto substrates to a greater extent than prior art catalysts.read more
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Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
TL;DR: In this article, a method for making integrated circuit wafers with vias or other openings in the wafer which openings have a barrier/adhesion or other metal layer which is metallized to form the circuit comprising activating the metal layer and then sensitizing the metallic layer using a sensitizing displacement composition comprising preferably an alkaline palladium non-ammonia nitrogen (ethylene diamine) complex.
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Catalyst solutions for activating non-conductive substrates and electroless plating process
TL;DR: Improved activation composition for preparing substrates for metallization in an electroless plating bath and improved process for activating substrates prior to metallisation using the improved activating process is discussed in this paper.
Patent
Method for directly electroplating a dielectric substrate and plated substrate so produced.
TL;DR: In this article, a method for the direct electroplating of a nonconducting substrate and plated substrates so produced is described, where the non conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine colloidal distribution of a noble or precious metal and tin to form a strongly adsorbed, uniform, conducting layer of micro fine colloidal metal cayatalyst upon at least a portion of the substrate surface.
Patent
Catalyst composition and method of preparation
TL;DR: In this article, dry colloidal catalyst compositions of catalytic metals and methods for formation of said dry compositions are described. But their methods are restricted to a specific class of colloidal catalysts: U.S. Pat. No. 3,011,920
References
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Novel precious metal sensitizing solutions
TL;DR: A new and useful PRECIOUS METAL SENSITIZING SOLUTION for RENDERING SURFACES RECEPTIVE to the dePOSITION of an ADHERENT ELECTROLESS METAL is provided in this article.
Patent
Metallizing of plastic materials
TL;DR: In METALLIZING of PLASTICS, the PLASTIC ARTICLES are sensitized with an ACID SOLUTION of a TRIVALENT METAL of the 5th MAIN Group of the PERIODIC TABLE, E.G. ARSENIC.