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Chip type electronic part and method of fabricating same

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The article was published on 1978-12-22. It has received 9 citations till now. The article focuses on the topics: Chip.

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Patent

Solid electrolytic capacitor

TL;DR: An outer insulation member made of a first resin packed a part of an anode terminal has a predetermined section as mentioned in this paper, which consists of a front surface, a back surface and edges connecting between the front surface and the back surface.
Patent

Solid-state electrolytic capacitor

TL;DR: In this article, a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board is used to construct a solid state electrolytic capacitance, which includes an anode body having a total thickness of an aluminum foil of 350 μm and a residual core thickness of 50 μm.
Patent

Solid electrolytic capacitor and method for manufacturing the same

TL;DR: In this article, a solid electrolytic capacitor is constructed with a capacitor element C sealed inside a resin package 6 and extending an anode wire 7 from an element body 4 by a conductive beam member.
Patent

Chip-type solid electrolytic capacitor

TL;DR: In this paper, a chip-type solid electrolytic capacitor is used to facilitate positioning of a capacitor element to a lead frame, in such a way that parts of the respective terminals are exposed at least on a mounting surface of the capacitor element.
Patent

Steel for high-strength bolt, and high-strength bolt

TL;DR: This steel for a high-strength bolt contains 0.50-0.65 mass% of carbon, 1.5-2.5 mass% silicon, not less than 1.4 mass% manganese, and not more than 0.03 mass% in total of phosphor and sulfur, with the balance being iron and inevitable impurities as discussed by the authors.