Patent
Computer having a heat sink structure incorporated therein
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TLDR
In this paper, a computer has a chassis, a circuit board with a heat generating device mounted thereon, and a structural member with heat pipe disposed thereon; the structural member strengthened the chassis and provided convective transfer of the heat to the environment.Abstract:
A computer having a heat sink structure incorporated therein provides efficient heat dissipation for heat generating components within the computer. In a preferred embodiment, a computer has a chassis, a circuit board with a heat generating device mounted thereon, and a structural member with a heat pipe disposed thereon. The heat pipe transfers heat from the heat generating device to a heat dissipating portion of the structural member. The structural member strengthens the chassis and provides convective transfer of the heat to the environment.read more
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Heat dissipation device
TL;DR: In this article, a heat dissipation device includes a primary heat sink contacting a central processing unit and a secondary heat sink attached on heat-generating electronic components adjacent the central processing units.
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References
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Patent
Multiple-fan microprocessor cooling through a finned heat pipe
TL;DR: In this paper, a computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units is described, and the heat pipe provides computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.
Patent
Two-phase cooling system for laptop computers
TL;DR: In this paper, a two-phase cooling system for a portable computer is described, which consists of an evaporator which is positioned within the base of the computer and a condenser which is either attached to the lid of a computer or attached to a hinge on the computer.
Patent
Heat pipe exchanger system for cooling a hinged computing device
Rakesh Bhatia,Kevin Haley +1 more
TL;DR: In this article, a heat pipe exchanger system for cooling a hinged computing device is presented, where a heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening.
Patent
Dissipation of heat through keyboard using a heat pipe
TL;DR: In this article, an improved heat dissipation device was proposed for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer, which is at least partially filled with a heat conductive material, improving heat transfer between a component and a heat-conductive block mounted on opposite surfaces of the circuit board.
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Heat sink/component access door for portable computers
TL;DR: In this article, an access door for computer systems comprising an outer case containing an electronic component of the computer system that is capable of generating heat during the operation of the system is described.