Patent
Contact structure and production method thereof and probe contact assembly using same
TLDR
In this article, a contact structure for establishing electrical connection with contact targets is proposed, which is formed of a contactor carrier and a plurality of contactors, with an upper end oriented in a vertical direction, a straight beam portion oriented opposite to the upper end and having a lower end which functions as a contact point for electrical connection.Abstract:
A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contactor carrier and a plurality of contactors. The contactor has an upper end oriented in a vertical direction, a straight beam portion oriented in a direction opposite to the upper end and having a lower end which functions as a contact point for electrical connection with a contact target, a return portion returned from the lower end and running in parallel with the straight beam portion to create a predetermined gap therebetween, a diagonal beam portion provided between the upper end and the straight beam portion to function as a spring.read more
Citations
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Patent
Cantilever microprobes for contacting electronic components and methods for making such probes
TL;DR: In this article, compliant probe structures for making temporary or permanent contact with electronic circuits and the like have been described, including cantilever probes with extended base structures, slide-in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
Patent
High performance probe system
TL;DR: In this article, a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads are used to provide signal paths between an integrated circuit (IC) tester and input/output, power and ground pads.
Patent
Method and system for batch manufacturing of spring elements
TL;DR: In this article, a system for batch forming a sheet of spring elements in three dimensions is described. A spring element sheet containing spring elements defined in two dimensions is arranged between two mating die press plates.
Patent
Method and system for batch forming spring elements in three dimensions
Eric M. Radza,John D. Williams +1 more
TL;DR: In this article, a system for batch forming a sheet of spring elements in three dimensions includes a top spacer layer and a plurality of ball bearings arranged in a predetermined pattern on the top and bottom support layers.
Patent
Microprobe tips and methods for making
Kieun Kim,Adam L. Cohen,Willa M. Larsen,Richard T. Chen,Ananda H. Kumar,Ezekiel Kruglick,Vacit Arat,Gang Zhang,Michael S. Lockard +8 more
TL;DR: In this article, the formation of microprobe tips elements having a variety of configurations is described, in some cases the tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material.
References
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Patent
Sockets for electronic components and methods of connecting to electronic components
TL;DR: In this paper, a BGA-type semiconductor package was intended to receive a LGA-style package, and pressure contact was made between the resilient contact structures and external connection points of the package with a contact force which was generally parallel to the top surface of the support substrate.
Patent
Method of making microelectronic spring contact elements
TL;DR: In this paper, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate, and each spring contact element has a base end, a contact end, and a central body portion.
Patent
Methods and structures for electronic probing arrays
Joseph Fjelstad,John W. Smith +1 more
TL;DR: A probe card for testing electronic elements includes a layer of dielectric material provided with a plurality of cavities supported on a substrate as discussed by the authors, which electrically insulates the masses of fusible conductive material from one another.
Patent
Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
TL;DR: In this paper, spring contact elements are fabricated at areas on an electronic component remote from terminals to which they are electrically connected, where their free (distal) ends are disposed in a pattern and at positions which are spatiallytranslated from the pattern of the terminals on the component.
Patent
High density electrical interconnect apparatus and method
TL;DR: In this article, the authors present a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection, which can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, that is to be contained in and part of a system.