Patent
Cooling system for thin profile electronic and computer devices
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TLDR
In this paper, an apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is described, which includes an air duct comprising a thermally conductive housing having internal fins dispersed along the internal walls of the duct.Abstract:
An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having internal fins dispersed along the internal walls of the duct. An air flow generator produces an air flow that is directed from an inlet port located at or near the center of the air duct to first and second exit ports located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component to the air duct housing.read more
Citations
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Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit
Ishikawa Kenichi,Katsumi Hisano +1 more
TL;DR: In this article, an electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing, and a heat receiving head thermally connected to the heat generator is accommodated inside the housing.
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TL;DR: In this article, an apparatus and method are described for cooling electronic components (119, 121) on a plug-in or other computer board within an enclosure, which is capable of cooling a high power dissipating device such as a Graphics Processing Unit and cooling individual ones of a plurality of other devices, such as memory chips, to within a specified temperature range.
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Apparatus for cooling a heat generating component in a computer
Damon W. Broder,Charles D. Hood +1 more
TL;DR: In this paper, the reliability and effectiveness of the cooling apparatus are greatly increased through the use of a heat pipe having two condenser regions that are attached to different types of heat dissipating bodies.
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Heat sink assembly with rotating heat pipe
Charles D. Hood,Peter Liu +1 more
TL;DR: In this article, a portable computer includes a chassis having a heat producing electronic component mounted therein, and a heat sink is mounted in the chassis adjacent the component, where the heat pipe has a first end rotatably connected to the heat sink and extends to a second end engaged with the component.
References
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Patent
Heat sink for cooling a heat producing element and application
Tadashi Katsui,Katsuhiko Nakata,Takeshi Koga,Tadanobu Matsumura,Yoshimi Tanaka,Yasuaki Sugimoto,Takashi Kitahara,Takayuki Horinishi +7 more
TL;DR: In this paper, a heat sink mounted on a heat producing element for cooling the heat-consuming element attached on the printed board of the electronic apparatus is described, where the heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly.
Patent
Multiple-fan microprocessor cooling through a finned heat pipe
TL;DR: In this paper, a computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units is described, and the heat pipe provides computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.
Patent
Two-phase cooling system for laptop computers
TL;DR: In this paper, a two-phase cooling system for a portable computer is described, which consists of an evaporator which is positioned within the base of the computer and a condenser which is either attached to the lid of a computer or attached to a hinge on the computer.
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Optical network unit
TL;DR: An optical network unit for field installation adjacent to an optical fiber transmission line, for separating multiplexed video and telephony signals for delivery to subscribers residences as electrical signals over metallic drop cables, has a hollow housing formed of heat-conductive material.
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Dissipation of heat through keyboard using a heat pipe
TL;DR: In this article, an improved heat dissipation device was proposed for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer, which is at least partially filled with a heat conductive material, improving heat transfer between a component and a heat-conductive block mounted on opposite surfaces of the circuit board.