Patent
Dielectric heating using inductive coupling
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TLDR
In this paper, a method and apparatus for heating or drying material by applying radio frequency (RF) power to a material in a resonant cavity is presented, where an RF power source is inductively coupled to a cavity formed by distributed inductance in resonance with the applicator and material where the magnetic field established by the feed line(s) induces a voltage on the applicators permitting feed line voltages delivering said RF power to the cavity to be lower than those that would normally be encountered for equivalent RF heating using direct coupling.Abstract:
A method and apparatus for heating or drying material by applying radio frequency (RF) power to a material in a resonant cavity; wherein an RF power source is inductively coupled to a resonant cavity formed by distributed inductance in resonance with the applicator and material where the magnetic field established by the feed line(s) induces a voltage on the applicator permitting feed line voltages delivering said RF power to the cavity to be lower than those that would normally be encountered for equivalent RF heating using direct coupling.read more
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