Patent
Electroless gold plating method
Abstract:
PROBLEM TO BE SOLVED: To provide an electroless gold plating technique for performing electroless gold plating on a nickel plating under-layer formed on a conductor circuit, which effectively inhibits separation phenomenon at solder/nickel interface formed through soldering of the gold plating and the nickel plating under-layer. SOLUTION: In the electroless gold plating method, the nickel plating for forming the under-layer is performed on the conductor circuit, and the electroless gold plating is performed on the nickel plating under-layer. After the nickel plating, the surface of the nickel plating under-layer is subjected to gold- or palladium-catalyzed activation treatment and subsequently to reductive gold plating. Alternatively, after the nickel plating, reductive palladium plating and electroless gold plating are successively performed. COPYRIGHT: (C)2005,JPO&NCIPIread more
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Patent
Printed wiring board
TL;DR: In this paper, a printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure forming on the opposing surface of a substrate.
Patent
Electroless gold plating bath, electroless gold plating method and electronic parts
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Patent
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TL;DR: In this paper, the reduction precipitation type electroless gold plating liquid is used to directly deposit a gold-plating film on a palladium film, which is favorable for the surface treatment of a conductor circuit of a printed circuit board.
Patent
Electroless gold plating method and gold-plate-coated material
TL;DR: In this article, a non-cyanide gold plating bath is used for forming a foundational alloy layer, and a gold plate layer is formed on the foundational alloy by means of electroless reduction plating using a noncyanides gold bath, characterized by the foundational layer being an M1-M2-M3 alloy.
Patent
Electroless gold plating method for electronic component, and electronic component
TL;DR: In this paper, an electroless gold plating method for an electronic component is proposed, in which an substitution gold-plating film is formed on the electronic component having the part to be plated composed of a copper or copper alloy based stock, and the reducing agent in the plating liquid is a phenyl compound based reducing agent expressed by general formula.
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Patent
Plating structure of bonding part
TL;DR: In this paper, the Ni-B plating contg. 0.01 to 10% B is first formed at a thickness of 0.005 to 5 μm and then Au is plated in superposing thereon.
Patent
Substrate for mounting semiconductor and its production
TL;DR: In this paper, a substrate for mounting the semiconductors is constituted by forming an electroless nickel plating film on circuits consisting of metals, forming a electroless palladium plating on the electroless nithophosphorus alloy plating, and forming an electrical gold plating (EPGP) on the EPHP plating.
Patent
Electroless gold plating method
TL;DR: In this paper, an electroless gold plating method which is suitable to manufacture a printed circuit board having a high reliability is presented. But the method is executed by forming a substrate layer on a base by electroless nickel plating and forming a gold coating film on this substrate layer by the electroless gating method in such a case, metallic layers (Pt, Pd, Ru and Rh) other than gold which are more noble than nickel are formed on the substrate layer.