Patent
Etching of polyimide films
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TLDR
In this paper, a photo sensitive resist of a predetermined viscosity and utilizing hydrazine as an etchant to remove unwanted sections of the polyimide film after exposing and developing the light sensitive resist is presented.Abstract:
A process for the etching of polyimide films which includes applying a photo sensitive resist of a predetermined viscosity and utilizing hydrazine as an etchant to remove unwanted sections of the polyimide film after exposing and developing the light sensitive resist.read more
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Positive working thermally stable photoresist composition, article and method of using
TL;DR: In this article, a positive working, thermally stable photoresist, comprising a light-sensitive orthoquinone diazide or naphtho-quinone Diazide and a polyamic acid condensation product of an aromatic dianhydride and an aromatic di-primary amine, is presented.
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Selective etching method of polyimide type resin film
TL;DR: In this article, a selective etching method of a polyimide type resin film which uses an etching mask consisting of a negative type photoresist material prepared by adding a photosensitive reagent to an unsaturated ketone polymer such as polymethylisopropenylketone as the base resin and an etch solution consisting of 20 to 40% by volume of hydrazine hydrate and the balance of polyamine.
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References
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Patent
Additives to positive photoresists which increase the sensitivity thereof
TL;DR: The use of a scanning electron beam to generate a pattern in a positive photoresist is known as mentioned in this paper, and it has been discovered that by adding certain compounds to photoresists of the quinone diazid type, the sensitivity or speed of the photoreformer is substantially increased.
Patent
Process for electroplating polyoxymethylene resins
TL;DR: In this article, a procedure for pre-preparing POLYOXYMETHYLENE HOMOPOLYMER for ELECTROPLATING by ACID ETCHING, E.G. in OrthopHOSPHORIC ACID, FOLLOWED by BASIC TREATMENT, 10% SODIUM HYDROXIDE.