Patent
Fasteners for surface mounting of printed circuit board components
TLDR
In this article, a fastener is provided for mounting a heat sink to the surface of a circuit board, which includes a body having structure extending from the body for engaging the heat sink.Abstract:
A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.read more
Citations
More filters
Patent
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
TL;DR: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package to provide an area to solder to conductors on a PC board Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of a package adjacent the leads as discussed by the authors.
Patent
Heat sink mounting assembly for surface mount electronic device packages
Clemens Donald L,Gary K. Kuzmin +1 more
TL;DR: In this article, a mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package (SME device package) is presented, which consists of a heat generating device package, a mounting attachment, and heat sink.
Patent
Shielding and cooling arrangement
TL;DR: In this article, a planar shielding hood and cooling elements are mounted on a circuit board, and when the component is to be cooled, the cooling element is placed either on the component or on the shielding hood over the component.
Patent
Heat sink for chip stacking applications
Kevin G. Duesman,L. Jan Bissey +1 more
TL;DR: In this paper, a heat sink is provided for use with stacks of integrated chips, which includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of chip stack.
Patent
Heat sink mounting method and apparatus
TL;DR: In this article, a method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the support member.
References
More filters
Patent
Index mounting unitary heat sink apparatus with apertured base
TL;DR: In this paper, a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermal transfer plate adjacent one major face of the device package is described.
Patent
Frictionally engageable heat sink for solid state devices
TL;DR: In this paper, a heat sink for solid state devices is provided to frictionally engage either a solid state device having a heat conductive tab extending therefrom or a solid-state device of the type having a cylindrical body.
Patent
Heat sink mounting
TL;DR: In this paper, the authors present a method for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end and a tin-plated head stud.
Patent
Integrated circuit terminal and method
TL;DR: A sheet metal terminal is formed of spring metal such as brass with a plurality of terminals attached to one another in chain fashion by a carrier strip of scrap of the metal blank from which the terminals are formed.
Patent
Solderable mounting stakes for heat sinks
TL;DR: In this paper, a solderable stake for attaching a heat sink to a mounting board such as a circuit board or the like is described, which can be attached to the circuit board by conventional soldering simultaneously with soldering of other component leads and the like.