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Journal ArticleDOI

Force and electrical Thevenin equivalent circuits and simulations for thickness mode piezoelectric transducers

Roy W. Martin, +1 more
- 01 Aug 1975 - 
- Vol. 58, Iss: 2, pp 475-489
TLDR
In this article, a simple model for thickness-mode piezoelectric elements used as ultrasonic transducers in measurement systems is presented. But the model is not suitable for the case of a transducer.
Abstract
A simple model is reported for thickness‐mode piezoelectric elements used as ultrasonic transducers in measurement systems. The model represents the excitation system and transducer as a Thevenin mechanical equivalent for the transmitting mode and a Thevenin electrical equivalent for the receiving mode. Computer programs based on the model have been developed, and computer simulations to study the effects of backing materials, element areas, and excitation sources are reported. The nature in which the source impedance alters the Thevenin mechanical output impedance and its importance in determining peak transmission frequency and in computing acoustic coating layers for matching was found. A total transfer improvement of 28 dB was shown for epoxy‐backed elements radiating into fluid with the transducer used as both transmitter and receiver by using high values of source and load impedances in contrast to low values. The model was found to agree closely with experimental data of a 2.7‐MHz transducer.Subject Classification: 85.40; 80.70; 85.52.

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Design guidelines for medical ultrasonic arrays

TL;DR: In this article, the basics of ultrasonic transducer array design in the frequency range useful for medical imaging are discussed and the advantages of computer modeling in 3D with finite element analysis code are highlighted.
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TL;DR: This article presents standard methods to match the acoustic impedance of the piezoelectric sensors, actuators, and transducers with the surrounding wave propagation media.
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Patent

Electroacoustic transducer calibration method and apparatus

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