Handbook Of Electronics Packaging Design and Engineering

TLDR: In this article, the authors present a discussion of materials for Electronic Packaging, including material plating and finishes, and materials and processes for Electronic Assemblies, as well as material and process considerations for electronic parts and equipment.

Abstract: 1 Electronics Packaging Design and Engineering.- 2 Project Planning.- 3 Human Factors Engineering.- 4 Fabrication Processes.- 5 Mechanical Fasteners.- 6 Heat Transfer and Thermal Control.- 7 Shock and Vibration Design.- 8 Subassemblies and Assemblies.- 9 Design Considerations for Space Electronics.- 10 Material Plating and Finishes.- 11 Radio Frequency and Electromagnetic Shielding.- 12 Design and Development of Miniature Electronics Systems.- 13 Wire and Cabling.- 14 Materials and Processes.- 15 Safety.- 16 Printed Circuits.- 17 Electrical Interconnection Systems.- 18 Forced Air Cooling Systems.- 19 Preferred Materials for Electronic Packaging.- 20 Selection of Plastics for Various Environments.- 21 Mechanics of Simple Stresses.- 22 Formulas and Conversions.- 23 Design Reviews-An Instrument for Decision Making.- 24 Slide Mount Considerations for Electronic Assemblies.- 25 Reference Designations for Electrical and Electronic Parts and Equipment.- 26 Metal Alloy and Temper Designation Systems.- Appendix A.- Appendix B.