Patent
Heat radiating structure for solid-state image sensor, and solid-state image pickup device
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TLDR
In this article, a heat radiating member was mounted on a solid-state image sensor for cooling the image sensor while reducing external force loads applied to the sensor with a relatively simple structure.Abstract:
In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.read more
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References
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Patent
Solid-state image pickup device
TL;DR: In this paper, the authors proposed to make the weight of the device light by mounting an diaphragm control circuit outputting a control signal to an diAPHragm device of an objective lens to a camera head.
Patent
Cooling system for cooling a solid-state imaging device
TL;DR: In this article, a cooling system for cooling heat-producing electronic devices, such as CCDs, included in an electronic apparatus such as a television camera, comprises electronic cooling devices disposed near the heat-consuming electronic devices.
Patent
Heat radiating structure of electronic component
TL;DR: In this paper, the three legs of metal components 2 are inserted into a hole that is provided at the three leg of resins 4 so that the legs are exposed to the inside of the resin components 4.
Patent
Image pickup device
TL;DR: In this article, an image pickup device that is fixed on a camera casing is provided with a plurality of color separation prisms for separating incident light to prescribed color components, image pickup elements 4 fixed to the color component light projection sides 3aa, 3b, 3c of respective prisms, cooling elements 8 whose cooling faces are arranged on the elements 4, heat conduction plates 7 attached to the heating faces of the elements 8.
Patent
Heat dissipation device
TL;DR: In this article, a copper foil sheet 17 with excellent thermal conductivity is placed in face contact with a CCD 18 that is a heat generating body and an aluminum piece 14 with a high heat capacity is provided and in close contact with the shield case 15, through which the generated heat is conducted.