Patent
Lead frame incorporating material flow diverters
TLDR
In this article, methods and apparatuses for manufacturing a semiconductor device package utilizing a lead frame which has one or more encapsulant material flow diverters are presented. But the lead frame having material flow diversters includes a multiplicity of leads and at least one material flow flow diverter.Abstract:
Disclosed are methods and apparatuses for manufacturing a semiconductor device package utilizing a lead frame which has one or more encapsulant material flow diverters. The lead frame having material flow diverters includes a multiplicity of leads and at least material flow diverter. The material flow diverter is arranged in such a manner as to control the amount of encapsulant material which is directed both above and below an attached die during the encapsulation process.read more
Citations
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Patent
Lead frame and method of manufacturing the same
TL;DR: In this paper, a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion is described.
Patent
DC/DC Converter Power Module Package Incorporating a Stacked Controller and Construction Methodology
TL;DR: In this article, the authors describe methods and systems for enabling the efficient fabrication of small form factor power converters and also the small-form factor power converter devices, and present a detailed discussion of the power converter design.
Patent
Multiple leadframe package
TL;DR: In this article, the authors describe a semiconductor chip package with multiple leadframes, where a first leadframe has a die attach pad and a first plurality of electrical leads, a second leadframe that is generally parallel to the first one and having a second plurality of leads, and a plurality of direct electrical connectors between the first and second leadframes where such connectors control the distance between the leadframes.
Patent
Stacked leadframe implementation for dc/dc convertor power module incorporating a stacked controller and stacked leadframe construction methodology
Jaime A. Bayan,James D. Broiles +1 more
TL;DR: In this paper, the authors describe methods and systems for enabling the efficient fabrication of small form factor power converter packages and other devices using stacked leadframes, and show how to construct a stacked leadframe for power converter.
Patent
Leadframe alteration to direct compound flow into package
TL;DR: In this article, a leadframe comprising a downset formed adjacent to an edge of the leadframe is used to direct the molding compound to flow evenly inside the mold cavity.
References
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Patent
Lead frame and semiconductor device
TL;DR: In this article, a lead frame includes a die pad for mounting thereon a semiconductor chip having a plurality of electrodes, an outer frame for supporting the die pad and the plurality of leads, and a resin guide portion extending to the vicinity of die pad from the outer frame, for guiding molten resin over and under the semiconductor chips during resin packaging.
Patent
Method of uniformly encapsulating a semiconductor device in resin
Isamu Yoshida,Junichi Saeki,Shigeharu Tsunoda,Kunihiko Nishi,Ichiro Anjo,Imura Kenichi,Toshihiro Yasuhara,Junichi Arita,Kazuhiro Sugino +8 more
TL;DR: In this paper, a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage is disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.
Patent
Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
TL;DR: In this article, an IC pellet or chip supported on a mounting unit is encapsulated in plastics material, for example, epoxy resin or silicone resins, and a plurality of lead strips are disposed at one end in the proximity of the mounting part of the unit.