Patent
Metallized multilayer packaging film
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TLDR
In this article, a metallized multilayer film comprising a polypropylene homopolymer (OOP), on at least one surface of which is a polymer skin layer having a lower melting temperature than that of the core layer, the exposed surface of skin layer has been treated, e.g., flame or corona discharge treated, prior to coating to increase its adherence to other materials, the film substrate containing a metal deposit, e., aluminum, coated on the treated surface of the polymer skin layers, and a polymeric, low temperature sealable coating (LAbstract:
A metallized multilayer film comprising a film substrate having a polymer core layer, e.g., a polypropylene homopolymer (OOP), on at least one surface of which is a polymer skin layer having a lower melting temperature than that of said core layer, the exposed surface of skin layer having been treated, e.g., flame or corona discharge treated, prior to coating to increase its adherence to other materials, the film substrate containing a metal deposit, e.g., aluminum, coated on the treated surface of the polymer skin layers, and a polymeric, low temperature sealable coating (LTSC) comprising a copolymer of 10 to 35 wt.% of at least one alpha, beta-ethylenically unsaturated carboxylic acid, e.g., acrylic or methacrylic acid, with 65 to 90 wt.% of ethylene, an alkyl acrylate or methacrylate, acrylonitrile, or mixtures thereof on the surface of the metal deposit.read more
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References
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