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Photomasks for fabrication of semiconductor devices

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The article was published on 1968-05-28. It has received 7 citations till now. The article focuses on the topics: Mask inspection & Photomask.

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Patent

Method of forming thin optical membranes

Ray Winn
TL;DR: In this article, the authors proposed a method for making edge-supported and fully supported membranes with substantially uniform thickness, and substantially parallel surfaces, and having the capacity to transmit at least about 90% of incident light with very little diffraction, dispersion, or absorption.
Patent

Proximity printing method

TL;DR: In this paper, a predetermined small gap or gap between a semiconductor wafer and a mask is defined by projecting a cushion of air through a central mask aperture toward the wafer.
Patent

Mask for aligning patterns

TL;DR: In this article, a photo etching-mask is provided with a second pattern for pre-alignment which is smaller than and similar to the first pattern for alignment, a third pattern for precise alignment which is in a positional relation similar to that between the first and second patterns for alignment and which comprises stripes being at fixed intervals and differing in direction from the stripes.
Patent

Durable transparent mask for photolithographical processing and method of making the same

TL;DR: An indefinitely reusable transparent mask suitable for photolithographic uses, particularly for the production of semiconductor elements, preferably embodies a visually transparent image fused at least part way into a durable transparent substrate such as glass as discussed by the authors.
Patent

Process for utilizing a photoprinting article and method for making said article

TL;DR: In this article, a photographic master is described, which consists of a base of a transparent sheet, a plurality of upstanding configurations of exposed photographic emulsion material spaced in a predetermined pattern on the base, and a protective coating over the upstanding configuration and base to thereby provide a gas escapement means when the master is used to provide a pattern upon a metallic sheet in a contact printing process.
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