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Patent

Plating catalyst and method

TLDR
In this paper, the authors describe a catalyst solution consisting of a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom, which is useful for a catalyzing an electroless process for plating metal on nonconductive surfaces.
Abstract
A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.

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Patent

Nonmetal substrate high efficiency catalytic electrode and preparation method thereof

TL;DR: In this paper, a non-metal substrate is pre-treated and then immersed in an electroless plating solution, and the conductive catalyst is deposited on the substrate surface by using an Electroless Plating method, namely the catalytic electrode is prepared.
Patent

Catalyst for electroless plating, metallic coating film produced using same, and method for producing said metallic coating film

TL;DR: In this article, a catalyst for electroless plating composed of a complex of a compound (X) and metal nanoparticles (Y) is presented, wherein the compound (x) is produced by polymerizing a monomer mixture (I) containing a (meth)acrylic acid-based monomer having at least one anionic functional group selected from the group consisting of a carboxyl group, a phosphoric acid group and a phosphorous acid group.
Patent

Composition for preparation of plating base and plating base thereof

TL;DR: The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal particle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent as discussed by the authors.
Patent

Plating base composition and plating base formed of the same

TL;DR: In this article, a coating film obtained by applying and drying a metal nanoparticle dispersion or metal nanoparticles dispersion ink protected by a small amount of protectant is used as a plating base.
Patent

Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts

Benjamin Naab
TL;DR: In this paper, the walls of through-holes and vias of a substrate with dielectric material are electroless plated with copper using tin-free ionic silver catalysts.
References
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Patent

Metal nanoparticle compositions

TL;DR: A metal nanoparticle composition for the fabrication of conductive features was proposed in this paper, which has a low viscosity permitting deposition of the composition by direct-write tools and a low conversion temperature permitting its conversion to an electrical feature on polymeric substrates.
Journal ArticleDOI

Di(2-pyridyl)methylamine–palladium dichloride complex covalently anchored to a styrene-maleic anhydride co-polymer as recoverable catalyst for C–C cross-coupling reactions in water

TL;DR: In this paper, a polymer-supported di(2-pyridyl)methylamine-palladium dichloride complex covalently anchored to a styrene-alt-maleic anhydride co-polymer is prepared.
Patent

Catalytic metal of reduced particle size

TL;DR: In this paper, a catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent is used for the electroless metal deposition of substrates that are non-catalytic.
Patent

Reforming nanocatalysts and methods of making and using such catalysts

TL;DR: A dispersing agent is particularly useful for forming multicomponent catalysts comprising an alloy, combination, mixture, decoration, or interspersion of platinum and one or more of tin, rhenium or iridium as mentioned in this paper.
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