Proceedings ArticleDOI
Power delivery modeling and design methodology for a programmable logic device package
A. Pannikkat,J. Long,Jin Zhao +2 more
- pp 115-118
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TLDR
In this article, a power delivery modeling and design methodology for a programmable logic device package is presented, where the DC IR drop and high frequency power ground input impedance have been analyzed by commercial available power integrity software and calibrated with measurements.Abstract:
A power delivery modeling and design methodology for a programmable logic device package is presented in this paper. Both the DC IR drop and high frequency power ground input impedance have been analyzed by commercial available power integrity software and calibrated with measurements. Design modifications have then been carried out for power delivery system improvement of the package for next generation products.read more
Citations
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Journal ArticleDOI
Thermal-aware DC IR-drop co-analysis using non-conformal domain decomposition methods
Yang Shao,Zhen Peng,Jin-Fa Lee +2 more
TL;DR: In this paper, a non-conformal, non-overlapping domain decomposition method (DDM) was proposed for thermal-aware direct current (DC) IR drop co-analysis of high-power chippackage-PCBs.
Proceedings ArticleDOI
Analysis of IR-drop in 3-D IC packaging using a non-conformal domain decomposition method
Yang Shao,Zhen Peng,Jin-Fa Lee +2 more
TL;DR: A non-conformal, non-overlapping domain decomposition method (DDM) for the IR drop analysis of high-power integrated circuit (IC) package in which both dielectrics and non-ideal conductors coexist.
Journal ArticleDOI
Combination Approach of FEM and Circuit System in IR Drop Analysis and Its Applications
Zhanghong Tang,Jiansheng Yuan +1 more
TL;DR: In this paper, a method was developed to solve the combined system of the current field and the circuit, where the supernode was used to transform the matrix for conventional nodal analyses of a circuit system from non-positive definite to positive definite, and a positive definite matrix for the overall system was obtained by combining the matrix from the circuit nodal analysis method and the matrix resulted from finite element method (FEM) formulation.
Proceedings ArticleDOI
Measurement of worst-case power delivery noise and construction of worst case current for graphics core simulation
TL;DR: To intelligently optimize the graphics core power delivery network design and determining the right amount of decoupling capacitors, this paper suggests an approach that setup a working platform to capture the worst case power delivery noise; and later re-construct the worst cases power delivery current using Thevenin's Theorem.
Proceedings ArticleDOI
A finite-volume method for on-package IR drop characterization
Xin Wu,Chetan Desai +1 more
TL;DR: In this paper, a control-volume numerical method was developed for package IR drop analysis by meshing conductors and solving the governing equations using a finite-volume method with multigrid linear solver.