Patent
Process for producing a thermoelectric module
Toshitaka Ohta,Takenobu Kajikawa +1 more
TLDR
A thermoelectric module comprises a first electrode array having a plurality of electrode pieces and a second electrode array consisting of an additional plurality of electrodes pieces as discussed by the authors, where the first and second electrode arrays are confronted with each other.Abstract:
A thermoelectric module comprises a first electrode array having a plurality of electrode pieces and a second electrode array having a plurality of electrode pieces. The first and second electrode arrays are confronted with each other. The electrode pieces of the first electrode array are alternately connected with the electrode pieces of the second electrode array in such a way that one end portion of each electrode piece of the first electrode array is connected with one end portion of an electrode piece of the second electrode array through a thermoelectric element of first conductive type while the other end portion of the each electrode piece of the first electrode array is connected with one end portion of another electrode piece of the second electrode array through a thermoelectric element of second conductive type. The weight per unit output of the thermoelectric module is small.read more
Citations
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Patent
Thin-film thermoelectric device and fabrication method of same
TL;DR: In this article, a termoelectric device is defined as a set of thermoelements arranged in a matrix pattern having rows of alternating conductivity types, with at least one header having formed thereon a first interconnecting member with the first header mounted on the first major surface of the deposited film such that the header is connected to one side of the plurality of thermistors and connects adjacent thermistors of an opposite conductivity type.
Patent
Process for producing high performance thermoelectric modules
TL;DR: In this paper, a method for cost-effectively producing thermoelectric elements and modules with a multitude of thermocouple couples is disclosed. But this method is based on an additive technology using thermoclate pastes and a patternable insulator layer.
Patent
High performance P-type thermoelectric materials and methods of preparation
TL;DR: In this paper, a high performance p-type thermoelectric materials having enhanced thermocorlectric properties and the methods of preparing such materials were described, including a crystal growth method and a powder metallurgy method.
Patent
Method for making advanced thermoelectric devices
TL;DR: In this paper, the authors optimized for their electrical conductivity and thermal conductivity promise much higher thermoelectric cooling power in thermopiles with less electron current compared with present bulk materials.
Patent
Thermoelectric module having reduced spacing between semiconductor elements
TL;DR: An improved thermoelectric module is described in this paper, where a first electrically conductive pattern is defined on a first substrate and a second electricallyconductive pattern on a second substrate Alternating bars of a first thermoclectric material and another thermoconductive material are arranged parallel to each other.
References
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Patent
Method and apparatus for fabricating a thermoelectric device
TL;DR: In this paper, a method and apparatus for fabricating a thermoelectric device includes forming a matrix board (12) with an array of orifices (100) formed therein.
Patent
Thermoelectric device and method of making same
TL;DR: In this article, a thermoelectric device includes first and second sets of spaced apart copper plate segments, which are electrically and thermally fastened by a solder paste screen printed on the inner surfaces of the sets of plate segments.
Patent
Thermoelectric devices having improved elements and element interconnects and method of making same
Dalton R. Verner,Donald L. Heath +1 more
TL;DR: In this paper, a new and improved thermoelectric device and a method of manufacturing same takes advantage of the anisotropy of the materials employed to provide a substantially increased power output over prior art devices.
Patent
Tiered thermoelectric unit and method of fabricating same
TL;DR: In this paper, a thermoelectric unit is disclosed having superposed PN semiconductor (PN) stages (10, 12) thermally and electrically connected together by a planar ceramic coupler (14) therebetween.
Patent
Thermoelectric device including tin solder with particles of iron,cobalt or nickel
TL;DR: A self-spacing solder which has insoluble metallic particles dispersed through a soft solder component, the particles being of selected size in order to maintain the required spacing of surfaces to be soldered together is used to bond a thermoelectric body to one or more metallic contacts as discussed by the authors.