R
Rama Venkatasubramanian
Researcher at Texas Instruments
Publications - 177
Citations - 11189
Rama Venkatasubramanian is an academic researcher from Texas Instruments. The author has contributed to research in topics: Thermoelectric effect & Thermoelectric materials. The author has an hindex of 36, co-authored 176 publications receiving 10519 citations. Previous affiliations of Rama Venkatasubramanian include Durham University & University of Nevada, Las Vegas.
Papers
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Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
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On-chip cooling by superlattice-based thin-film thermoelectrics
Ihtesham Chowdhury,Ravi Prasher,Ravi Prasher,Kelly Lofgreen,Gregory M. Chrysler,Sridhar Narasimhan,Ravi Mahajan,David A. Koester,Randall G. Alley,Rama Venkatasubramanian +9 more
TL;DR: This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
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Thermal conductivity of Si–Ge superlattices
TL;DR: The thermal conductivity of Si-Ge superlattices with relatively longer periods, L>130 A, has smaller thermal conductivities than the short-period samples.
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Lattice thermal conductivity reduction and phonon localizationlike behavior in superlattice structures
TL;DR: In this paper, a study of thermal conductivities perpendicular to the interfaces in Si/Ge superlattices is presented, where a diffusive transport analysis suggests a low-frequency cutoff in the spectrum of heat-conducting phonons, which is comparable to that estimated from applying the Anderson criterion to the potential localization of phonon waves.
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Thermal Challenges in Next-Generation Electronic Systems
Suresh V. Garimella,Amy S. Fleischer,Jayathi Y. Murthy,A. Keshavarzi,Ravi Prasher,Chandrakant D. Patel,Sushil H. Bhavnani,Rama Venkatasubramanian,Ravindranath V. Mahajan,Yogendra Joshi,Bahgat Sammakia,B.A. Myers,L. Chorosinski,Martine Baelmans,P. Sathyamurthy,Peter E. Raad +15 more
TL;DR: The thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this article.