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Patent

Silver plating procedure

TLDR
In this paper, a silver electroplating procedure is described, which permits rapid and efficient plating and yields ductile, adherent silver films, and is also useful for a variety of silver alloys.
Abstract
A silver electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent silver films. The electroplating bath comprises silver complexed with an aliphatic polyamine compound with 3 to 20 carbon atoms. Particularly useful are such polyamines as diaminopropane (particularly 1,3-diaminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, etc. The procedure is also useful for electroplating a variety of silver alloys. In addition, the bath is highly stable, does not adversely affect the base material being plated and does not contain hazardous materials which require special disposal procedures.

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Citations
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Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like

TL;DR: In this paper, an electroplating direct current on the order of about 0.1 milliamp/cm2 is employed while superimposing a time varying electromagnetic field in the range of about 1 to about 100 megahertz on the direct current.
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TL;DR: In this paper, a process used during the manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating, and the tarnish inhibitor may be incorporated into the immersion plating bath.
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Method for enhancing the solderability of a surface

TL;DR: In this paper, a method for enhancing the solderability of a metallic surface was disclosed where the metallic surface is plated with an immersion silver plate prior to soldering and the plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines.
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Process for silver plating in printed circuit board manufacture

TL;DR: In this article, the authors describe a plating process in which silver ions oxidized copper and deposit a layer of silver at the surface of a bare board before mounting it to other components.
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Connector with locking ring

TL;DR: In this article, a connector is provided for mating with a mating connector, which includes a housing having an internal compartment and a locking segment, and a contact is held within the internal compartment of the housing.
References
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Patent

Electrolytic deposition of metal

TL;DR: In this paper, an improved method of electrolysis, including the electrodeposition of metals, and the composition of the electrolyte, is described, which relates to an improved approach to the preparation of an electrolyte.
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Silver electrodeposition process

TL;DR: In this paper, the authors described a solution for electrodepositing silver, comprising a soluble silver compound, a non-cyanide electrolyte and selected organic phosphonate compounds.
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Bright low karat silver gold electroplating

TL;DR: Disclosed is an aqueous electroplating bath and process for obtaining bright deposits of silver-gold alloys as mentioned in this paper, which contains a polyakylene imine and an alkylene polyamine.