Patent
Solderable pads utilizing nickel and silver nanoparticle ink jet inks
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TLDR
In this paper, a system and a method for ink-jet printing a solderable conductive pad onto a substrate is described, which comprises at least one print head and a curing station for curing an ink deposited onto the substrate.Abstract:
A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.read more
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Method of manufacturing electron-emitting device, electron source and image-forming apparatus
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