Patent
Surface release film and manufacturing method therefor
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TLDR
In this article, the surface release film is composed of an alicyclic olefin resin film having a deflection temperature under load of ≥160°C and <200°C.Abstract:
PROBLEM TO BE SOLVED: To provide a surface release film for use in hot press molding of a flexible printed circuit substrate that leaves no adhered material on the copper electrode parts on releasing, and to provide a manufacturing method therefor. SOLUTION: The surface release film is composed of an alicyclic olefin resin film having a deflection temperature under load of ≥160°C and <200°C, or is composed of a laminate of the film and a resin film. COPYRIGHT: (C)2001,JPOread more
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