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Patent

Surface wave device and its production

Kadota Michio, +1 more
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TLDR
In this paper, the authors proposed to obtain the surface wave device using an SH-type surface wave where the spurious due to a bulk wave is reduced and a package structure is simplified by emitting the formation of voids.
Abstract: 
PURPOSE:To obtain the surface wave device using an SH-type surface wave where the spurious due to a bulk wave is reduced and a package structure is simplified. CONSTITUTION:By providing a resin layer 13 formed on an upper surface 16a of a piezo-electric substrate 16 so as to cover an interdigital transducer, the package structure is simplified by emitting the formation of voids. Level differences 17a and 17b are provided on the end face of a piezo-electric substrate 16, end face parts 18a and 18b lower than the end faces 17a and 17b are made rough surfaces. By forming the resin layer 13 so as to cover the upper end face parts 19a and 19b, the spurious due to the reflection in the end face of the bulk wave is reduced in the surface wave device.

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Elastic boundary wave device

Satoru Matsuda, +3 more
TL;DR: An elastic boundary wave device as discussed by the authors includes a first medium with piezoelectricity, an electrode exciting an elastic wave and provided on the first medium, a second medium made of a different material from the first Medium and providing on the second Medium to cover the electrode, and a sound absorbing portion provided by the second medium.
Patent

Method of manufacturing piezoelectric device

Chokai Kazuhiro, +6 more
TL;DR: In this article, a method of manufacturing a piezoelectric device with which a structure preventing chipping or cracking can be easily obtained is presented. But the method is limited to the case where the surface including the inside of the dividing groove of the mount substrate and the cover substrate is covered with a protective material.