Patent
System for chip joining by short wavelength radiation
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TLDR
In this paper, a thin laser beam can be scanned under computer control across a chip to heat the areas of a chip above solder balls, and automatic temperature control of the chip can be provided by a heat detector or chip condition detector and a program controller in a feedback loop controlling laser power.Abstract:
Defective chips are removed from a substrate package. The package is cleaned. Replacement chips with solder bearing elements are replaced in the position(s) of the defective chip(s). Silicon chips are less damaged by heating with light wavelengths substantially shorter than infrared radiation, when the radiation is directed upon the upper chip surface and the lower chip surface carries circuitry and solder balls. Radiation is absorbed by the upper chip surface and converted there directly to heat, protecting the circuitry below. An argon-ion laser beam confined to a given chip is directed upon the upper surface of the chip to be soldered in place. A thin laser beam can be scanned under computer control across a chip to heat the areas of a chip above solder balls. Automatic temperature control of the chip can be provided by a heat detector or chip condition detector and a program controller in a feedback loop controlling laser power.read more
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References
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Patent
Method and apparatus for heat-bonding in a local area using combined heating techniques
TL;DR: In this paper, the authors present an approach for joining a dielectric or semi-conductive element to a metallic layer employing a combination of heating techniques, focusing on the side of the substrate opposite to the side on which the bond is to be formed, and in the region of said bond, and is at a level sufficient to heat the interface to a temperature greater than the bond point.
Patent
Integrated circuit chip repair tool
TL;DR: An integrated circuit chip repair tool for bonding or removing reflow soldered chips on multi-chip substrates having chip pickup means to move chips toward or away from a substrate, flame heating means to apply a concentrated source of heat to a single chip without overheating adjacent chips as mentioned in this paper.
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Dual in-line chip extractor-exchanger apparatus
TL;DR: In this article, the authors present an approach for removing and replacing dual in-line solid state circuit chip devices and/or receptacles or sockets from printed wiring or circuit (PC) boards.
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Scanning inspection system and method
Gugliotta G,King G +1 more
TL;DR: In this article, a small cross-sectional beam of radiant energy from a source such as a laser is directed by way of an optical scanning device onto a surface to be inspected, and the intensity of the reflected energy reflected from the surface of the object is measured to determine the quality of the surface.