Proceedings ArticleDOI
Vibration transmission in electronic packages having structurally complex design
J. M. Boiko,Igor Kovtun,Svetlana Petrashchuk +2 more
- pp 514-517
TLDR
In this paper, the theoretical model of the oscillating system representing electronic unit installed on the support subjected to vibration is described, and the problem of vibration transmission from the shaker to the tested electronic unit is explained as a complex problem to solve.Abstract:
The paper demonstrates that vibration sustained by electronic packages while their operation or tests cannot be characterized by vibration measured either on their supporting base or on the shaker transmitting this vibration. The theoretical model of the oscillating system representing electronic unit installed on the support subjected to vibration is described. Vibration transmission from the shaker to the tested electronic unit is explained as the complex problem to solve. The experimental measurement of vibration conducted inside of tested electronic units verified significant difference in amplitude of vibrations transmitted inside the units and external vibrations that units are exposed to.read more
Citations
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Journal ArticleDOI
Methods for Vibration Reduction in Enclosed Electronic Packages
TL;DR: In this paper, the main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronic package enclosure.
Journal ArticleDOI
Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method
TL;DR: In this article, a planar location model has been developed by the idea of remote detection of acoustic emission through the volume of homogeneous medium such as water, unlike detecting acoustic emission on the surface of printed circuit board where acoustic emission signal is likely to be distorted or even lost.
Book ChapterDOI
Stress Computation and Reduction by Cyber-Physical Systems Controlling Printed Circuit Board Manufacturing Technology
Igor Kovtun,Vilen Royzman +1 more
TL;DR: In this article, the problem of computation and control of technological and exploring strain transmission between structural elements of printed circuit board assembly was considered, and a computational model has been designed for stress estimation in structural elements.
References
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Analysis of enclosures and anti vibration devices for electronic equipment for space applications
TL;DR: In this article, the analysis of typical enclosures for electronics, and the anti-vibration devices for the Printed Circuit Boards (PCBs) currently used within the enclosures are presented and compared with the results obtained during random vibration tests.
Journal Article
Dislocation avalanches and strain bursts in the boards of electronic equipment
TL;DR: In this article, a cascade of navigation devices boards was installed on the vibration stand and experiments were performed in the 0.5 -10 Hz vibration range at 0 − +45 °C temperature.