What is ion beam sputtering?
Best insight from top research papers
Ion beam sputtering is a technique used in material processing where ions are directed towards a target material, causing atoms to be ejected from the target's surface. This process is crucial for various applications such as superconducting device fabrication and material analysis. Ion beam sputtering can be assisted by ion sources generating hollow ion beams, impacting target surfaces to sputter particles towards objects for modification. Recent advancements in plasma ion sources have enhanced the versatility of ion beam sputtering by allowing higher beam currents and the use of unconventional ion species, expanding the range of substrate materials that can be processed. The technique's effectiveness lies in its ability to precisely modify materials at the microscale and prepare samples for advanced analyses.
Answers from top 5 papers
More filters
| Papers (5) | Insight |
|---|---|
| Ion beam sputtering is the process of material removal using ions. The study explores multi-ion species plasma focused ion beams for varied milling rates and texturing artifacts on different materials. | |
| Ion beam sputtering is a process where ions are used to sputter particles from a target surface towards an object, modifying its surface, typically in radially extending directions relative to the beam axis. | |
| Ion beam sputtering is a technique where an additional ion source bombards the sample surface during sputtering, promoting better adhesion and surface annealing for thin film growth. | |
26 Oct 2022 | Ion beam sputtering is a technique utilizing ion bombardment during sputtering to enhance film adhesion and properties, as discussed in the research on titanium nitride thin films. |
28 Nov 2022 | Ion beam sputtering is a technique used in the study to grow titanium nitride thin films, enhancing superconducting properties by controlling critical temperature and nitrogen sensitivity during deposition. |
Related Questions
How does ion species like Argon, tungsten and Neon affect tungsten sputtering and reflection yiellds?5 answersIon species such as Argon, tungsten, and Neon play crucial roles in affecting tungsten sputtering and reflection yields. Argon atoms interacting with tungsten surfaces can lead to sputtering and material degradation events. Alternating bombardment with Argon and deuterium projectiles can predict mean sputtering yields, showing no synergistic effects in low-flux regimes. Neon seeding in fusion devices can cool plasma and protect tungsten targets, affecting sputtering rates by initially increasing and then decreasing them, showcasing a suppression effect. Calculations for beryllium and neon ions bombarding tungsten show good agreement with experiments, essential for understanding impurity supply during tokamak plasma interactions. High Power Impulse Magnetron Sputtering in Ar-Ne gas mixtures can control noble gas inclusion in tungsten coatings, with ion energy and flux influencing gas retention and film properties.
What is ionizing radiation?5 answersIonizing radiation is a form of energy that can detach electrons from atoms or molecules, leading to the creation of reactive species like ion-radicals and free radicals, which can initiate chemical reactions with high activation energies. This type of radiation includes high-frequency electromagnetic waves such as gamma rays and X-rays, which are capable of penetrating body tissues and causing damage at the molecular level. Sources of ionizing radiation vary, from radioactive elements on Earth to cosmic radiation from outer space. Exposure to ionizing radiation can result in various health effects, ranging from immediate tissue damage to long-term consequences like cancer and genetic disorders. Despite its potential risks, ionizing radiation has also been linked to the formation of organic compounds and the chemical evolution necessary for the origins of life, highlighting its dual role as both a friend and a foe in the context of life's development and evolution.
Why is use of argon gas common in rf sputtering as a glow discharge gas?5 answersThe common use of argon gas in RF sputtering as a glow discharge gas is due to its ability to produce highly excited and reactive species, making it ideal for various plasma-aided applications. Argon, along with other non-reactive gases like Xenon and Krypton, is utilized to generate plasma in systems like hall thrusters, offering efficient performance with minimal voltage requirements for extended operation. In DC glow discharge systems, argon exhibits properties that are crucial for plasma generation, with electron density increasing with pressure while other parameters decrease. Additionally, in a DC glow discharge model with metastable argon atoms and dust particles, the densities of these species strongly influence gas discharge parameters, highlighting the significance of argon in plasma processes.
What is the role of substrate biasing in magnetron sputtering?4 answersSubstrate biasing plays a crucial role in magnetron sputtering. It has been observed that the application of substrate bias can significantly affect the properties of the deposited films. Depending on the polarity of the substrate bias, it can either increase or reduce the flux of structure-forming elements to the substrate, thereby altering the growth rate of the film without compromising its surface morphology or perfection. In the case of AlN deposition on rolled Ni substrates, a negative substrate bias was found to improve the quality and homogeneity of the deposited layer, leading to higher piezoresponse and better performance for vibration energy harvesting applications. Similarly, in the sputter deposition of Al thin films, the combination of bias magnitudes and sputtering pressures influenced the microstructure, surface roughness, film resistivity, and grain size, with lower resistivity values achieved at specific substrate bias values. The use of substrate biasing in combination with deep oscillation magnetron sputtering has also been shown to enhance the properties of tantalum coatings, resulting in improved mechanical properties and reduced roughness. In magnetron sputtered Ni-Zr alloyed thin films, negative substrate bias voltage was found to affect the microstructural evolution, mechanical properties, and scratch resistance, with an increase in the amorphous phase and specific crystalline phases observed at higher bias voltages.
How to calculate sputtering power density?3 answersSputtering power density can be calculated by analyzing the plasma parameters and target characteristics. Optical emission spectroscopy and Langmuir probe measurements can be used to estimate the composition and parameters of the plasma, such as electron temperature and density. The power density can be determined by dividing the target power by the target area. In high-power impulse magnetron sputtering, a non-stationary global model based on particle and energy conservation equations can be used to calculate the time evolution of particle densities and fluxes to the target and substrate. The increasing target power density leads to a transition to a metal-dominated discharge plasma with a higher degree of ionization of the depositing flux. The average fraction of target material ions in the total ion flux onto the substrate can be used to assess the power density.
How does Sputtering work for nanomaterials synthesis?5 answersSputtering is a physical method used for the synthesis of nanomaterials. It involves the deposition of a thin layer of nanoparticles on a substrate, followed by annealing to determine the size and shape of the nanoparticles. Sputtered nanostructures have shown superior electrochemical performances due to their rich structural motifs and morphological features, making them suitable for clean energy conversion reactions. Traditional sputtering techniques with solid substrates allow for facile composition control but have limitations in size control. However, recent advancements in "liquid medium sputtering" using ionic liquid and low-volatile polymer media have provided a method that combines the advantages of chemical and physical methods for nanoparticle synthesis. This technique has potential applications in the generation of electrocatalysts for oxygen reduction reactions. Overall, sputtering offers a versatile and efficient approach for the synthesis of nanomaterials with controlled properties for various applications.