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What is the effect of PCB solder resist on heat dissipation in electronic components? 


Best insight from top research papers

The solder resist ink used in PCBs has been developed to address the issue of heat dissipation in electronic components. By adding a heat dissipation material to the solder resist ink, the printed circuit board (PCB) is able to achieve self-heat dissipation and cooling effects, resulting in a reduction of the circuit board's temperature by 3-20 degrees Celsius . This heat dissipation effect is achieved without changing the structure of the electronic product, thereby increasing product stability . Additionally, the use of a thermal connection element in the PCB enhances the heat dissipation ability of the heating device and improves the heat distribution on the PCB, resulting in a more uniform temperature distribution and a reduction in hot-spot temperature . These advancements in PCB technology contribute to better heat dissipation in electronic components.

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Papers (4)Insight
Patent
Zeng Fanwu, Hu Baobao 
01 Feb 2019
1 Citations
The provided paper does not mention the effect of PCB solder resist on heat dissipation in electronic components.
Patent
Wu Dong, Rong Binjie, Xia Siyu 
14 Sep 2016
1 Citations
The provided paper does not mention the effect of PCB solder resist on heat dissipation in electronic components.
Patent
Shi Qibiao, Wen Xuhui 
12 Oct 2018
1 Citations
The provided paper does not mention the effect of PCB solder resist on heat dissipation in electronic components.
The provided paper does not mention the effect of PCB solder resist on heat dissipation in electronic components.

Related Questions

How does the solder resist on PCBs affect thermal conductivity and heat dissipation?4 answersThe solder resist on PCBs can significantly affect thermal conductivity and heat dissipation. One approach is to add a heat dissipation material and an auxiliary agent to the solder resist ink, which can reduce the temperature of the circuit board by 3-20°C and improve heat dissipation without changing the structure of the electronic product. Another method involves using a new Photo-imageable Solder Resist (PSR) with high thermal conductivity, which can reduce the junction temperature of the IC package by about 3-8K and provide stable electrical performance. Additionally, the thermal performance of the solder joint in a high volume production can be evaluated using a simple and rapid measurement method that utilizes thermal characterized reference devices. Furthermore, the heat dissipation characteristics of a PCB can be improved by using various heat dissipation structures, such as via holes and heat sinks, to transfer and dissipate heat more effectively. Finally, a heat-dissipating resin composition containing nanofiber-type aluminum nitride can enhance the thermal conductivity and heat-dissipating characteristics of the solder resist, making it suitable for use in PCBs.
Is there a paper talking about dissipation in the heart ?4 answersDissipation in the heart is discussed in several papers. Anssari-Benam et al. propose a dissipation function to capture the rate-dependent mechanical behavior of heart valves. Endo et al. evaluate the heat transfer characteristics of an electrohydraulic totally implantable artificial heart (EH-TAH) and discuss the acceptable thermal effect of the system. Bryan et al. examine the contribution of uptake processes in the dissipation of 5-hydroxytryptamine (5-HT) in the coronary circulation of the rat heart. Nawrat discusses the energy dissipated in blood and on the elements of a total artificial heart (TAH), including valves, and analyzes the energetic aspects of the Polish total artificial heart (POLTAH). These papers provide insights into dissipation in the heart, including mechanical, thermal, and energetic aspects.
How does heat dissipation affect the Fischer–Tropsch process?5 answersHeat dissipation plays a crucial role in the Fischer–Tropsch process. Effective heat dissipation is necessary to maintain optimal operating conditions and improve the overall efficiency of the process.The cooling system in a Fischer-Tropsch reactor helps remove heat generated during the reaction.This is achieved through the use of downcomers, which deliver a coolant downward through the reactor, and risers, where a portion of the coolant vaporizes to provide a boiling heat transfer surface.By controlling the velocity and pressure of the coolant, the cooling system ensures that the coolant remains in a liquid phase along the length of the downcomers, preventing any loss of coolant due to vaporization.This helps maintain the stability and efficiency of the Fischer-Tropsch reaction.Additionally, the heat dissipation system described inimproves the radiating efficiency by reducing air flow imbalance caused by turbulent flow.
Any studies that investigantes the temperature reduction on PV panel using PCM in CFD?5 answersStudies have been conducted to investigate the temperature reduction on PV panels using phase change materials (PCM) in computational fluid dynamics (CFD) simulations. These studies have examined the impact of cooling systems composed of heat sinks with flat fins and layers of various types of PCM on the temperature of the PV panels. The simulations have been based on the CFD method using software such as ANSYS Fluent and COMSOL-Multiphysics to solve the conservation equations and optimize the temperature distribution and liquid fraction of the system. The selection of suitable PCMs with specific characteristics, such as melting temperature and latent heat, has been found to increase the efficiency of the cooling system and improve PV panel performance. Additionally, the use of nano-enhanced phase change materials (NePCM) with nanomaterials like graphene nanoplatelet (GNP) and copper oxide (CuO) has shown promising results in reducing PV panel temperature and increasing electricity generation.
How does burn-in affect the cooling performance of a board?5 answersBurn-in affects the cooling performance of a board by implementing various cooling mechanisms. One approach is to use fans to blow cool air directly onto the burn-in boards, ensuring quick cooling and stability. Another method involves generating a circulating gas stream within a chamber, where a gas stream linearizing device is used to mainly linearize the gas flow near the burn-in board, facilitating heat extraction. Additionally, a burn-in device can have a cooling mechanism that forces cooling air to flow along the circuit board and components, effectively cooling the board and soldered parts. In a burn-in oven, individual fans associated with each device under test provide air flow directly onto the devices, while adjustable dampers allow for a bleed flow of cooling air, enhancing cooling performance. These cooling strategies ensure that the burn-in boards are efficiently cooled during the testing process.
How do birds achieve heat dissipation throught vasodilatation?4 answersBirds achieve heat dissipation through vasodilation, which involves the dilation of blood vessels in peripheral tissues. This response helps to reduce heat loss and cold injury in low ambient temperatures. When birds are facing a perceived imminent food shortage, they show rapid local heterothermic responses, including vasoconstriction of peripheral tissues. However, in the case of sudden disruption of a predictable food supply, birds selectively allow the bill to cool through vasodilation. This pre-emptive response helps to minimize the depletion of body reserves for a perceived future shortage in energy. The cooling of the bill is an autonomic response that occurs immediately upon food restriction. Additionally, the eye-region temperature remains at similar levels throughout food restriction, possibly to maintain steady circulation to the central nervous and visual systems.

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