What is the effect of the temperature on copper electrodeposition?
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Temperature plays a crucial role in copper electrodeposition, influencing grain size, microstructure, and material properties. Lower temperatures near the freezing point of the electrolyte result in abnormal properties. At 298 K, copper electrodeposition without bonding pressure leads to high joint strength and distinct grain regions. Higher temperatures enhance diffusion and mass transfer during electrodeposition, affecting nucleation and crystallization rates, ultimately improving copper recovery efficiency. Varying reaction temperatures during Cu2O film electrodeposition affect crystal structure, morphology, and optical properties, with different band gaps observed for Cu(I) and Cu(II) oxides . Overall, temperature variations significantly impact the electrodeposition process and the resulting material characteristics in copper-based systems.
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11 Citations | Deposition temperature affects key properties of electrodeposited cuprous oxide films, altering crystallite size, morphology, band gap, photoluminescence, and photo response, as shown in the study. |
11 May 2018 4 Citations | The annealing temperature affects the performance of electrodeposited copper oxides, with CuO showing better stability and different photo response compared to Cu2O due to varying bandgaps. |
| Temperature near the freezing point of the electrolyte impacts copper electrodeposition, influencing grain size evolution from 0.25 μm to 1 μm and then to 0.6 μm, altering nucleation and growth processes. | |
8 Citations | Copper electrodeposition for bonding at 298 K resulted in a high joint strength of 240 MPa with fine columnar, ultrafine, and recrystallized grain regions, enhancing microhardness compared to base metal. |
| Increasing temperature enhances copper electrodeposition by promoting diffusion and mass transfer, leading to larger, rougher electrodeposits, and improved copper recovery efficiency, as shown in the study. |
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