Showing papers on "Chemical resistance published in 1983"

A lanthanum titanium porous glass ceramic

Abstract: Studies on the substitution of the end-member oxides in the ternary sodium borosilicate system have included work on the replacement of SiO2 with combinations of La2O3 and TiO2 which after heat treatment resulted in leachable sodium borate and insoluble La2O3-TiO2 ceramic phases. Sensitivity to impurities during this phase decomposition is illustrated by the differences in physical properties, chemical resistance properties and structures of the insoluble phase when results obtained from melts from Pt/Rh or Al2O3 crucibles are compared. These materials exhibit after leaching interconnected pores with surface area of up to 217 m2 g−1 and pore radii ranging between 1.2 and 10.25nm with noteworthy alkali resistance of up to 0.08×10−2 mg dm−2 Na2O mg calculated on the whole surface area of the samples.

Molding resin composition

Abstract: PURPOSE: To obtain a composition suitable for large-size molded articles, having excellent chemical resistance, impact resistance, regidity and low thickness dependence of impact resistance, consisting of a rubber-reinforced resin composition comprising two graft polymers of specific structure and saturated polyester resin CONSTITUTION: (A) 50-95 pts wt rubber-reinforced resin composition comprising A 1 : 10-90 wt% graft copolymer having 20-150 wt% graft ratio obtained by polymerizing one or more compounds selected from aromatic vinyl compound, vinyl cyanide compound, etc, in the presence of a rubber-like polymer having ≥50 wt % gel content and 005-03μ weight-average particle diameter, A 2 : 10-90 wt% graft polymer having 20-100 wt% graft ratio prepared by polymerizing a compound selected from aromatic vinyl, vinyl cyanide, etc, in the presence of a rubber-like polymer having 03-05μ weight-average particle diameter and A 3 : 0-80 wt% copolymer prepared by polymerizing an aromatic vinyl, etc; is blended with (B) 50-5 pts wt saturated polyester resin (eg polytetramethylene terephthalate) COPYRIGHT: (C)1991,JPO&Japio

Sheet for jacketing of floppy disk

Abstract: PURPOSE:To obtain a light-weight sheet for jacketing having inherent surface- specific resistance and high chemical resistance, by using mainly polypropylene or its copolymer with addition of the conductive carbon black. CONSTITUTION:The 10% polyethylene, 7% paraffin chloride, 2% antimony oxide and 10% conductive carbon black are mixed thoroughly into a 100pts. propylene- ethylene copolymer containing 5% ethylene. This mixture is pelletized with a pelletizer, and this pellet is formed into a sheet shape through a T dice extruder. A corona discharge process is applied to the sheet to obtain a jacket sheet of a floppy disk. This sheet excels in the resistance to the chemicals with a light weight in comparison with a PVC, and the 10 -10 OMEGA surface specific resistance value is obtained with the compounding of the conductive carbon black.

Glass for substrate

Abstract: PURPOSE: To obtain alkali-free glass for a substrate having superior heat resistance and chemical resistance, suitable for manufacture in large quantities, and useful to form a thin film of a semiconductor, a metal or the like by adding a plurality of specified oxides to high aluminous alkaline earth metallic aluminosilicate. CONSTITUTION: This glass consists of, by mole, 45W60% SiO 2 , 20W35% AlO 3/2 , 1W5% ZrO 2 , 10W25% MgO, 2W10% RO (R is Ca, Ba or Sr) and 2×10 -4 W2× 10 -3 % R' 2 O 3 (R' is As or Sb). The glass belongs to high aluminous alkaline earth metallic aluminosilicate. The heat resistance and chemical resistance are improved by adding ZrO 2 , and bubble removal and refining are accelerated by adding at least one between As 2 O 3 and Sb 2 O 3 . The glass has superior heat resistance and chemical resistance, contains no alkali, and can be manufactured in large quantities at a low cost unlike quartz glass. The glass is suitable for use as glass for a substrate for forming a film of a semiconductor, a metal or the like. COPYRIGHT: (C)1985,JPO&Japio

Floor-and wall-coating or road-marking composition

Abstract: PURPOSE:To prepare the titled composition having excellent weather resistance and chemical resistance, and high durability owing to the moderate strength and flexibility, by compounding an acrylic acid ester, a specific polymer, a plasticizer, a compound containing polymerizable double bond, a paraffin, etc. at specific ratios. CONSTITUTION:The objective composition is prepared by compounding (A) 100pts.wt. of a mixture of (i) 51-85wt% of a (meth)acrylic acid ester, (ii) 10- 24wt% of a polymer or copolymer soluble in the component (i), and (iii) 5-25% of a plasticizer soluble in the component (i) (e.g. dibutyl phthalate) with (B) 0.1-10pts.wt. of a compound having two or more polymerizable double bonds in one molecule [e.g. ethylene glycol di(meth)acrylate] and (C) 0.1-5pts.wt. of a paraffin and/or a wax having a melting point of >=40 deg.C. EFFECT:It has moderate curing time and no deteriorating effect to the workability in the application. It has excellent curability and workability even at a temperature of as low as <=5 deg.C. USE:Floor coating, wall coating and road marking.

Preparation of resin composition for coating compound

Abstract: PURPOSE:The titled composition providing a marine structure, etc. with improved thick coating properties, weather resistance, water resistance, chemical resistance, etc., by heat-treating a mixture of an oil-modified alkyd resin modified with (semidrying) drying oil and an unsaturated polyester, cooling it, dissolving it in a polymerizable monomer. CONSTITUTION:(A) 20-80wt% oil-modified alkyd resin modified with (semidying) drying oil (preferably having an acid value of 10-40) consisting of (i) fatty acid or fats and oils, (ii) polybasic acid (e.g., phthalic anhydride, etc.), and (iii) polyhydric alcohol is blended with (B) 80-20wt% unsaturated polyester, to give a uniformly compatibilized resin. This is heat-treated at 180-240 deg.C for 30min- 12hr, cooled, and dissolved in (C) 40-150pts.wt. based on 100pts.wt. resin of polymerizable monomer[e.g., cyclohexyl (meth)acrylate, etc.], to give the desired composition. This is provided with curing properties at normal temperature by (D) a catalyst blended with cobalt naphthenate, etc.

Imidazolylsuccinic acid compound and curing of epoxy resin using it

Abstract: NEW MATERIAL:A compound shown by the formula I (R2 is H, methyl, ethyl, undecyl, heptadecyl, or phenyl; R4 is H or methyl). EXAMPLE:2-Ethylimidazolyl-succinic acid. USE:A latent curing agent or latent curing promotor for one component-based or one-pack type epoxy resin. Having small rise and change in viscosity causing reduction in workability in long-term storage at room temperature, slightly causing phase separation, curable quickly and effectively by heating in curing, providing an improved cured material having balanced properties of electrical insulating properties, characteristics in mechanical strength chemical resistance, etc. PROCESS:1mol imidazole unsubstituted at 1-position shown by the formula II is reacted with >=1mol maleic acid preferably in an inert solvent at >=100 deg.C, especially preferably >= about 130 deg.C to give a compound shown by the formula I .

Composite magnetic material for molding

Abstract: PURPOSE:To obtain a molded article having high heat and chemical resistance, as well as superior mechanical strength by obtaining a composite magnetic material composed 50-97wt% magnetic powder containing a binder having epxoy resin of 100-1,000 by epoxy equivalent and phenolic resin acting as a hardener to the epoxy resin. CONSTITUTION:Using, as a binder, a mixture of epoxy resin of 100-1,000 by epoxy equivalent and phenolic resin acting to the epoxy resin as a hardening agent, a magnetic composite material is prepared containing magnetic powder of 50-97wt%. For preparing the compound material, 100 part of bisphenol A- type epoxy resin, 25 part of cresol novolac resin, 2 part of diethyl imidazole, 120 part of barium ferrite, 25 part of silane coupling agent, and 4 parts of Hoechst wax OP are mixed by a mixer. After kneading by a hot roll at 70-110 deg.C, the mixture is cooled and pulverized to obtain the composite material. By using this composite material, it is possible to improve heat resistance, chemical resistance, and mechanical strength of the products.

Zinc dust paint and production of metallic base material coated with the same

Abstract: PURPOSE:A zinc dust paint containing a specific polyhydroxypolyether resin as a binder is coated on a metallic material to give coating films with high processability, flexibility and chemical resistance. CONSTITUTION:A metallic base material such as zinc phosphate-treated and cold milled steel plate is coated with (A) a zinc dust paint containing (B) a polyhydroxy polyether resin having a recurring structure unit of the formula (R is residue of monocyclic and difunctional phenol; R' is residue of polycyclic phenol; n is positive integer; n' is 0, positive integer and 35<=n+n'<=400) as a binder and dried to form coating films. EFFECT:The resultant coating films are durable and flexible to withstand various severe conditions accompanied by processing such as embossing, compression or bending and to show good fabricability.

Thermosetting type resin composition

Abstract: PURPOSE:The titled composition for providing a cured material having improved compression strength, chemical resistance, electrical characteristics, heat resistance or heat insulating properties, obtained by blending a granular or powdery nitrogen-containing phenol-aldehyde resin with another curable resin and/or a filler CONSTITUTION:(A) A granular or powdery resin obtained by condensing a phenol with a nitrogen-containing compound (eg, ures, melamine, guanidine) having at least two active hydrogens and an aldehyde, having a ratio of the maximum absorption strength D2 at 960-1,020cm to the highest absorption strength D1 at 1,450-1,500cm in infrared absorption spectrum by KBr tablet method of D2/D1 of 01-20, comprising spherical particles with 01-100mu particle diameters and their secondary agglomerates, having improved shelf stability, flow characteristics and reactivity is blended with (B) another curable resin (eg, novolak, epoxy, melamine resin) and/or (C) a filler (eg, carbon fiber, or silica)

Production of phenolic resin composition for flame-retarding laminate

Abstract: PURPOSE:To obtain the titled composition excellent in punchability, heat resistance and chemical resistance, by reacting a phosphate ester compound of novolak phenol-formaldehyde resin with a (semi)drying oil fatty acid and then converting the product to a resol form. CONSTITUTION:A phosphate ester compound of a novolak phenol-formaldehyde resin or a mixture of this compound and a phenol (e.g., phenol, cresol) is reacted with a drying or semidrying oil fatty acid (e.g., soybean oil, tall oil fatty acid) and then, after the addition of formaldehyde, the product is converted into a resol form in the presence of a basic catalyst (e.g., ammonia water, trimethylamine). Heat resistance and solvent resistance, in which an additive type phosphate ester compound is lacking, are markedly improved, and it becomes possible to obtain a resin composition capable of providing laminates showing desired flame retardency and punchability without using a halogenated epoxy compound, etc., which is expensive and is lacking in storage stability of prepregs.

Low-viscosity organic impregnating agent and its impregnation

Abstract: PURPOSE:To improve water resistance and workability, by impregnating a porous part with the titled impregnating agent obtained by adding proper amounts of a polymerization initiator and a polymerization inhibitor to a mixed system of a hydrophilic (meth)-aryclic acid ester monomer and a hydrophobic (meth)acrylic acid ester monomer. CONSTITUTION:0.2-4wt% coupling agent and 100-1,000ppm polymerization inhibitor and 1.5-3wt% polymerization initiator (e.g., benzoyl peroxide) are added to a given amount of an acrylic acid or methacrylic acid ester (the solubility of the impregnating solution is in a range of 5-30wt%) (e.g., methacrylic acid 2-hydroxylmethyl) having at least one hydrophilic functional group and a given amount of a hydrophobic acrylic acid or methacrylic acid ester (e.g., methyl methacrylate) to give the desired impregnating agent. A porous part is impregnated with the agent by preferably evacuation/immersion/compression (B process), it is saturated with the impregnating solution, and the impregnated part is washed with a cleaning water. EFFECT:Improved solvent resistance and chemical resistance.

Yellow isoindolinone pigment

Abstract: NEW MATERIAL:A yellow isoindolinone pigment of formula, having a specific surface area of 5-20m /g, having alpha-crystal form, and composed of essentially cubic or cuboidal particles. USE:Pigment for coloring an olefin resin, especially polyethylene resin, etc. in clear yellow color having excellent heat resistance, light resistance and chemical resistance. The deformation of the molded article, e.g. warpage and distortion, etc. caused by the crystallization shrinkage of polyethylene in the melt color molding of polyethylene, etc. can be prevented by the use of the pigment. PROCESS:The objective pigment is prepared e.g. by hydrolyzing an alkali metal salt of the compound of formula with an organic acid such a acetic acid in a nonpolar solvent such as monochlorobenzene at 0-175 deg.C for 0.5-4hr.

Photopolymerizable imide monomer

Abstract: NEW MATERIAL:A photopolymerizable imide monomer shown by the formula II (R is bifunctional organic group). USE:Useful as a raw material for forming a cured material of a heat-resitant resin. Having a cinnamoyl group sharply inductive by light rays in the molecule, having improved photosetting properties, improved stability as a photosetting composition in a solution state, not being gelatinized in a short period even by allowing it to stand at room temperature. Providing a material to be bonded with improved adhesiveness, forming a cured material of a heat-resistant resin having improved characteristics such as heat resistance, electrical insulating properties, water vapor resistance, chemical resistance, etc. after photosetting. PROCESS:An imide-amine shown by the formula II is reacted with a cinnamic acid shown by the formula III (X is hydroxyl group, alkoxy, preferably 1-5C alkoxy or halogen) or its derviative in an organic solvent such as N,N-dimethylformamide, etc. or in the absence of a solvent, to give a compound shown by the formulaI. The amount of the compound shown by the formula III is 1.7-2.2 times the molar quantity of the compound shown by the formula II.

Photosensitive resist material

Abstract: PURPOSE:To obtain a positive type resist material having high resolving power, high photosensitivity and superior chemical resistance and suitable for us in the manufacture of an integrated circuit, etc. by adding a compound forming an amine compound on being irradiated with light to a phenyl isopropenyl ketone (co)polymer in a specified ratio. CONSTITUTION:A resist material is prepared by dissolving 80-99.9wt% photosensitive polymer and 0.1-20wt% acetoanilide or other compound forming an amine compound on being irradiated with light in toluene, ketone or N-methylpyrrolidone. Said polymer consists of 10-100mol% phenyl isopropenyl ketones represented by the formula[where R is H, CH3, OCH3, Cl, Br, I, NH2 or N(NH3)2 and n is polymn. degree]and 90-0mol% addition-polymeriable monomer having a CH2=C group such as styrene or an acrylic monomer. The resist material has high sensitivity to ultraviolet rays, electron beams, X-rays, etc. and is suitable for use in the manufacture of an integrated circuit, etc. as a positive type sensitive resist with a superior adhesive property to a support, superior dry etching resistance, work efficiency, etc.

Production of polysulfoxide carbonate

Abstract: PURPOSE:To produce the title polymer excellent in impact resistance, heat resistance, light fastness, chemical resistance, etc., without any environmental pollution, by reacting a dihydroxydiaryl-sulfoxide compound with a compound having an N, N'-carbonyl bond. CONSTITUTION:A dihydroxyidaryl sulfoxide compound (e.g., 4,4'-dihydroxy- diphenyl sulfoxide) is reacted with a compound having an N, N'-carbonyl bond, e.g., N, N'-carbonyldiimidazole. The use of compond B which has a reactivity equal to that of phosgene can eliminate countermeasures against toxicity and equipment corrosion caused by unreacted phosgene and hydrogen chloride gas formed and facilitate the production of a polysulfoxide carbonate excellent in cracking resistance, impact resistance, heat resistance, light fastness, chemical resistance, etc.

Two-packe type adhesive composition

Abstract: PURPOSE:A nonsolvent-type adhesive composition that is composed of two components of a polyorganosiloxane with functional groups on chain terminals, thus showing high adhesion, heat resistance, chemical resistance and water resistance. CONSTITUTION:The objective two-component composition comprises (A) a polyorganosiloxane or formula I or II (X is hydroxyl, mercapto, amino, isocyanate, epoxy, glycidyl, aziridinyl, hydroxyl, mercapto, amino and/or carboxyl; R is 1- 20 hydrocarbon; R is 1-10 hydrocarbon; n is average bond number of polysiloxane mixture in formula III, 0-200) and (B) a polyfunctional compound free from siloxane bonds having a plurality of isoyanate, epoxy, aziridinyl, hydroxyl, mercapto, amino and/or carboxyl functional groups.

Powder coating with thermoplastic aromatic polyether ketone resin

Abstract: PURPOSE:To form a coating film excellent in insulation, corrosion resistance, by a method wherein a thermoplatic aromatic polyether ketone resin having a particular intrinsic viscosity and particle size is attached to the surface of a base, allowed to flow, and then cooled. CONSTITUTION:A powder coating material contg. a repeating unit of formulaI alone or together with other repeating units (e.g., those of formulas II, III, or IV), intrinsic viscosity of 0.3-2.6, pref. 0.5-1.8 and average particle size of 5-400mu, pref. 10-200mu, is attached to the surface of a base, allowed to flow at 350-450 deg.C, and then cooled. A rigid coating film excellent in adhesion to the surface of a metal base, chemical resistance, heat resistance, electrical insulating properties, and appearance, with good workability is formed.

Raw material for heat-resistant polymer

Abstract: NEW MATERIAL:The compound of formula[X is -NHCN; R1 is phenylene, naphthylene, biphenylene, etc. which may have substituent group (CH3, OCH3, C2H5, OC2H5 or halogen); R2 is same as R1 or ethylene, propylene, etc.; Y is -NR3CO- or -CONR3- (R3 is H or lower alkyl)]. EXAMPLE:N,N-p-Phenylenebis(m-cyanamidobenzamide). USE:Intermediate for the preparation of heat-resistant polymer. The compound has high activity to heat and is curable under relatively mild heating condition, e.g. heating at about 170-250 deg.C in powdery form, and gives insoluble and infusible heat resistant polymer having excellent physical properties such as heat resistance, chemical resistance, impact resistance, etc. PROCESS:The compound of formulaIis prepared by reacting the corresponding diamine (X is NH2) or its mixture with cyanogen bromide in an organic solvent such as DMF, DMA, etc. in the presence of a basic substance such as KOH, Ca(OH)2, etc.

Resin composition for electrical insulation of dynamo stator core

Abstract: PURPOSE:To provide a resin compsn. for electrical insulation of dynamo stator core having coating film excellent in hardness, moisture resistance, chemical resistance, curing characteristics, adhesion, etc., by blending an unsatd. epoxy ester with an oil-modified unsatd. polyester in a specific wt. ratio. CONSTITUTION:An unsatd. epoxy ester (A) given by the reaction of a polyepoxide (e.g., polyol glycidyl polyether) with an alpha, beta-unsatd. monobasic acid (e.g., methacrylic acid), alpha,beta-ethylenically unsatd. dibasic acid, etc., and an oil- modified unsatd. polyester (B) given by the reaction of acid components (e.g., maleic acid), glycol components (e.g., propylene glycol), and oil-modifying components (e.g., linseed oil) are blended in a ratio of 10-70wt% based on the total amts. of components A and B, of component B, preferably by the addn. of a photoinitiator (e.g., benzoin) to yield the titled resin compsn.