Showing papers on "Conductive ink published in 1993"

Porous substrate and conductive ink filled vias for printed circuits

Abstract: A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

Water-based polymer thick film conductive ink

Abstract: The present invention relates to an aqueous conductive polymer thick film-forming composition comprising a water-soluble thermoplastic polymer, a polymer dispersion in water, a glycol drying-retarder agent, an electrically conductive amount of conductive metal and/or carbon particles and water. The composition in the production of a highly printable conductive thick film ink.

Touch sensitive switch pads

Abstract: A touch sensitive switch pad. The switch pad includes a flexible film with a two conductive ink patterns on one side and an adhesive on the other. The adhesive backing can be of the peel off type such that a user simply peels off a protective backing to reveal the adhesive. The conductive ink patterns are disposed sufficiently close to each other such that there is a high probability that when a user touches the pad, a closed circuit occurs between the two patterns. Each conductive ink pattern is connected to an electrical contact which in turn can be connected to switching circuitry which is sensitive enough to sense the high resistance closed circuit. An extra adhesive-backed flap connected to the film and disposed in close proximity to the electrical contacts can be used to help protect the electrical contacts.

Pliable illuminated fabric articles

Abstract: An illuminated fabric article (10) includes a flexible substrate sheet (34) to which conductive ink traces (38) and lights (20) attach. The substrate sheet (34) has a low resilience so as not to press against skin (12) after it wrinkles or otherwise deforms to accommodate body (14) curves and movement. A cloth material having a thin flexible polymer film (40) applied over a woven cloth backing (42) represents one example of a suitable substrate sheet (34). A conductive ink which remains flexible after curing is applied to the substrate sheet (34) to form the conductive traces (38), which convey electrical energization to the lights (20). Each light (20) attaches to the substrate sheet (34) and to the conductive traces (38) through the use of a non-conductive adhesive patch (64) and two conductive adhesive patches (66). The lights (20) on the substrate sheet (34) are arranged to be visible from an exterior side (28) of a textile ( 26) so that they may be visually perceived from a distance.

Self-defogging mirror

Abstract: A device for heating a mirror so as to prevent the formation of fog thereon. There is a generally planar electric heating element for the back surface of the mirror, and an electrostatic shield which is mountable between the heating element and the reflective coating on the mirror, so as to prevent the development of an electrostatic charge between the element and coating. The electrostatic shield may be provided by a layer of high resistance conductive ink printed on a sheet of insulation; the conductive material is connected to ground potential as provided by the neutral lead of a household AC power supply. The heating element may also be provided by high resistance conductive ink printed on a sheet of insulation, with low resistance ink being printed over this to provide a power distribution/return network.

Ink replenishment system for a continuous ink jet printer

Abstract: A continuous ink jet printer employing conductive ink and having a main ink supply (14), a supplemental ink supply (30), and a replenishment carrier fluid supply includes an ink replenishment system that replenishes ink or carrier fluid based on the resistivity of ink in the main ink supply (14).

Solder paste and conductive ink printing stencil cleaner

Abstract: A solder paste or conductive ink printer stencil wiper apparatus combining a dual action of sucking stencil holes and simultaneously wiping the bottom of the stencil for excess solder. The apparatus includes a vacuum nozzle constructed and arranged to draw excess solder gathered in the holes of the stencil through the nozzle to a collection reservoir. The apparatus also includes a wiping element for wiping the bottom of the stencil at the same time the vacuum is sucking solder out of the stencil holes. The wiper includes a wiper fabric to wipe the bottom of the stencil. The fabric is provided on a roll, and the fabric is pulled through a series of rollers by a motor and collected on a take-up roller.

Non-toxic fabric conductors and method for making same

Abstract: An electrical conductor and method of making same is disclosed whereby the conductor is particularly suited for use in soft children's toys because it is washable, non-toxic, safe, durable and crumple-resistant The conductor is comprised of a nonwoven material which has been impregnated with conductive ink to form electric circuits within the fiber of the material The circuits conduct currents sufficient to drive a plurality of detachable integrated circuits which are actuated by the pressing of pressure-sensitive switches which touch two conductive fabric traces to complete a circuit Additionally, the conductors may be designed to have different resistances and combined within a circuit to form electric components capable of controlling and directing the flow of current

Two-layer membrane switch

Abstract: A two-layer membrane switch particularly suited for application as a keyswitch in low-profile keyboard applications, such as keyboards for notebook or laptop type personal computers. When used as a keyswitch, the switch comprises a first conductor layer including a conductive ink patterned as an electrical contact on a polyester dielectric film around an opening through the film. A second conductor layer, also includes a conductive ink patterned as an electrical contact on a polyester dielectric film. With the electrical contact of the second conductor layer located under the corresponding opening in the first conductor layer, a moveable, conductive elastomer switch closure is used to establish electrical contact between the electrical contact of the first conductor layer and the electrical contact of the second conductor layer through the opening in the first conductor.

Improvements in surge diverters

Abstract: A protection arrangement for electricity distribution lines (14) includes a plurality of stacks (18) of metal oxide varistors MOVs (16), said stacks (18) being arranged in parallel Each stack (18) is internally fused using a thin, wide strip of copper encapsulated in a flameproof material An alarm (22) and status display (26) may be provided within a single module (32) Each MOV (16) may have an individual fuse (134) An alternative alarm system may be provided using an insulating mask applied over a fuse (134), over which a conductive ink (138) is applied, the ink (138) being connected to an alarm Failure of an MOV (16) will physically rupture the ink (138) leading to an alarm being created

Conductive ink for use with printed circuit modules

Abstract: A printed circuit module, particularly for electronic applications and equipment, comprising a rigid or flexible circuit carrier substrate (1), conductive traces (2) printed on the substrate, and electronic components (5) for electrical connection thereto. The conductive traces comprise a printed ink layer having fine conductive particles embedded therein. The ink is rendered conductive by a touch-contact distribution of the particles in the printed ink layer. The conductive particles comprise electrically conductive crystallites (8) composed of a non-oxidizable crystalline compound of an element of sub-group IV of the Periodic Table, along with nitrogen or carbon. The electronic components (5) are electrically connected to the conductive traces (2) with an anisotropic adhesive (7). The adhesive may also contain the crystallites to effect an electrical connection between the conductive traces (2 ) and the contact areas (6 ) of electronic components (5 ) .

Device for manufacturing tape wire and manufacture thereof

Abstract: PURPOSE:To easily manufacture a tape wire suitably used in a downsized electronic equipment without increasing the cost. CONSTITUTION:This device has a heating roll which is rotated while nipping a pair of insulating tapes fed out from a feed roll, and heats the insulating tapes, thereby forming a tape wire in which the insulating tapes are mutually fused and integrated together. This device also has a printer device 15 for spraying a conductive ink to one insulating tape T1 to form a conductor line D. The printer device 15 is formed of an injecting mechanism 28 having ink jet nozzles 28 for injecting the conductive ink arranged at intervals over the cross direction of the insulating tape T1, and a masking sheet 27 provided between the ink jet nozzles 28 and the insulating tape T1 and having a plurality of slits 31 for passing the conductive ink injected from the ink jet nozzles 28.

Transparent conductive and moistureproof laminated sheet

Abstract: PURPOSE:To secure excellent steam and oxygen barrier properties and transparency by providing a conductive ink layer and a surface resin layer to one surface of a base sheet consisting of a plurality of base films and arranging a linear low density polyethylene resin layer and a conductive paint layer to the other surface thereof. CONSTITUTION:In a laminated sheet 1, a base film 5 composed of a polyvinylidene chloride resin or an ethylene/vinyl alcohol copolymer resin and a base film 2 composed of a biaxially stretched polyester film are laminated through an adhesive 6 to form a base sheet 10 and a transparent conductive ink layer 3 is formed to one surface of the base sheet 10 and a surface resin layer 4 is laminated to the ink layer 3 in a dotted form while a linear low density polyethylene resin layer 8 is laminated to the other surface of the base sheet 10 through an extrusion coating layer 7 and a conductive paint layer 9 is patternwise formed to the layer 8. By this constitution, excellent steam and oxygen barrier properties and transparency are secured.

Conductive paste printing method and printer

Abstract: PURPOSE: To obtain conductive ink printing method and conductive ink printer, which makes the stabilization of printing conditions and the automatic feeding of conductive ink paste during printing possible by a method wherein printing is performed under the condition that the conductive ink paste is shielded from external space. CONSTITUTION: At the rightward printing, a squeezee 1a is moved under the contact state with proper printing pressure sent on mask 5 and, at the same time, flooding is performed with a scraper 2 provided between squeezees 1a and 1b. A side plate 7 moves under the condition being come into contact with the mask in order to suppress the effect of the air to conductive ink paste 4. Next, at the leftward printing, a squeezee 1b is moved under the state with proper printing pressure set on the mask 5 so as to perform the same printing as the rightward printing. The side plate 7 moves similarly as that moves at the rightward printing. At this time, since the paste 4 is shielded from external space, the change of the air temperature giving effect to the paste and the change of the viscosity of the paste due to the volatilization of solvent can be suppressed, resulting in allowing to prevent the poor printing such as bleeding and the like from occurring. COPYRIGHT: (C)1994,JPO&Japio

Semiconductor chip mounting method

Abstract: PURPOSE:To provide an inexpensive semiconductor chip mounting method by which low-temperature treatment can be conducted. CONSTITUTION:After a circuit pattern 2 is formed by printing conductive ink on a wiring board substrate 1 and a semiconductor chip 3 provided with bump electrodes 4 is positioned on the circuit pattern 2, the electrodes 4 are connected to the pattern 2 by heating the electrodes 4 and pressing the chip 1 against the substrate 1 and, at the same time, the space between the bottom surface of the chip 3 and upper surface of the substrate 1 is molded with an insulating resin 5.

Negative type liquid crystal display element

Abstract: PURPOSE:To improve a contrast and to obtain excellent electrostatic resistance by forming films consisting of colored conductive ink on the surface of the liquid crystal display element. CONSTITUTION:Light shielding films are formed at need on the parts exclusive of display parts of a pair of substrates provided with electrodes and thereafter, oriented films are formed and are subjected to an orientation treatment. The oriented film surfaces are disposed to face each other and the periphery is sealed by a sealing material and a liquid crystal is sealed in the inside to form a liquid crystal cell 2. Polarizing plates are provided on both sides thereof. The films 1 consisting of the colored conductive ink are formed on at least one surface of the liquid crystal display element and the surface resistance of the films 1 is 10kOMEGA/cm . The element surface is printed with a light shielding mask (black frame) to prevent the light leakage from the sealing part, by which the contrast is improved. Conductive particles are dispersed and mixed in and with the ink of such black printing 1, by which an electrical conductivity is provided on the ink.

Method for fabricating an electrically conductive article of manufacture

Abstract: A method for fabricating an electrically conductive article of manufacture, comprising printing an image corresponding to the article of manufacture onto an expungeable substrate using a conductive ink or conductive toner material and subsequently disposing of the expungeable substrate having the image thereon so that only the article of manufacture remains. The method is particularly adapted for use in producing a control grid of a corona generating device as utilized in electrostatographic printing apparatus.

Multilayer circuit board and method of manufacturing it

Abstract: PURPOSE:To make possible the high-accuracy thin precision structure of a multilayer circuit board by a method wherein structures, wherein a metal oxide optical semiconductor layer formed with through holes consisting of a metal conductive path formed by selective reduction and circuit patterns are formed in order, are laminated on circuit patterns formed on the surface of an insulative support body, each structure being a constituent unit. CONSTITUTION:A metal layer formed on an electrically insulative support body 1 is subjected to circuit etching or conductive ink is printed to form a first layer circuit 2 and an optically memorizing metal oxide optical semiconductor layer 3 is formed on the circuit 2. According to the formation of the layer 3, a photography pattern 4 for through hole use, which is kept previously formed, is aligned and is closely exposed and if an electrolysis is performed, zinc fine particles are accumulated and through holes 5 are formed. Then, a metal film is formed on the whole surface and when arbitrary circuits 6 are formed by etching, the circuits 2 and 6 are electrically connected to each other via the holes 5 and a two layer circuit board is obtained. Thereby, the formation of a fine precision circuit and reduction in the thickness of the circuit become possible.

Flexible circuit board

Abstract: PURPOSE:To provide a flexible circuit board which materializes electromagnetic shielding and electrostatic shielding without marring the flexibility or without increasing the thickness. CONSTITUTION:A thin metallic deposited layer 15 approximately 1000-3000Angstrom thick is made by depositing copper on the rear of a film base material 11 consisting of polyester, for example, 38mum thick. Next, a wiring circuit 12 is made on the surface of a film base material 11. To be concrete, the wiring circuit 12 is made by screen printing method, using conductive ink wherein thermoplastic resin such as polyester or urethane is made a binder. As a result, electromagnetic shielding and electrostatic shielding can be gotten without marring the flexibility of a flexible circuit board and without increasing the thickness.

Electro-magneto-hydrodynamic ink drop generator.

Abstract: The printhead comprises an array of tubular ink-projecting tubes which have internally thereof respective pairs of spaced electrodes, and which has means for generating a magnetic field in the vicinity of the electrodes. When a current is passed through a conductive ink in a said tube, the interaction between the current through the ink and the magnetic field causes movement of the ink, whereby a droplet is ejected from the open end of the tube. As shown (Fig 1) a printhead comprises a row of tubes (14) of rectangular (square) cross section in an insulator (24). The electrodes (16, 18) are applied to opposed walls of the tubes (14) and the magnetic field is generated between laminar magnets (20, 22) which sandwich the insulator (24). It is stated that the printhead is able to produce recordings with continuous tonal gradation.

Forming method of printed wiring pattern

Abstract: PURPOSE:To form a wiring pattern by using conductive ink, after a negative pattern opposite to the wiring pattern is formed by using insulative ink. CONSTITUTION:When insulative ink 12 is pushed out on a board 11 from a screen print 14 having a negative pattern, a negative pattern of the insulative ink 12 is formed. Conductive ink 13 is pushed out from a screen print 15 having a wiring pattern, and these patterns are overprinted. Thereby a wiring pattern of the conductive ink 13 is formed on the board 11.

Electric transfer recording apparatus

Abstract: PURPOSE:To provide an electric transfer recording apparatus which can sufficiently cool and solidify the ink at a general separating position of a conductive ink sheet and a recording paper without changing the separating position. CONSTITUTION:A guide roller 12 is provided at a separating position between a conductive ink sheet 1 and a recording paper 2 at the side more downstream in the running direction of the ink sheet 1 than the printing position by a recording head 5. A heat pipe 21 is connected to this guide roller 12 so as to cool the roller 12 and turn the ink immediately to the cooled state.

Bonding method for semiconductor device

Abstract: PURPOSE:To enable junction without installing expensive gold bumps on pads of a semiconductor device and reduce production cost dramatically. CONSTITUTION:Conductive ink 20 is applied to each terminal 2a of a wiring board 10 while a bonding material, (anisotropic conductive bonding agent) which contains conductive particles 4 in an insulating bonding agent 3a, is interposed between a semiconductor device 10 are the wiring board 1. Then, each pad 11 of the semiconductor device 10 is aligned with each terminal f the board 1 where the semiconductor device 10 and the board 1 are relatively depressed so that each terminal 2a of the board 1 may be connected with each mating pad 11 of the semiconductor device 10 by way of the conductive particles 4 respectively. Furthermor, the semiconductor device 10 is bonded and joined with the board 1 by means of an insulating bonding agent 3a.

Manufacture of el element

Abstract: PURPOSE:To reduce the rate at which brightness of an electroluminescent element is lowered at early stages of lighting and to prolong the life of the element by forming a conductive layer, a dielectric layer and a light-emitting layer on a base film by means of screen printing in sequence, and setting the water content of this stack to no more than 0.2%. CONSTITUTION:Conductive ink having silver powders dispersed therein is screen printed on a base of a polyester film 4 or a nylon film 6 and is dried to form a conductive layer 3. Ink having dielectric substance such as barium titanate dispersed therein is similarly printed thereon and is dried to form a dielectric layer 2 and further ink in which emitter particles composed chiefly of zinc sulfate are dispersed is similarly printed thereon and is dried to form a light- emitting layer 1 to fabricate a stack. When the water content of the stack is not less than 0.2%, the stack is dried by heat to reduce the water content and then a polyester film 5 equipped with a transparent electrode is stuck onto the layer 1 and a nylon film 6 and a fluorine film 7 are stuck to the upper and lower surfaces of the stack, respectively, to obtain a product.

Multilayer circuit board

Abstract: PURPOSE: To obtain a multilayer circuit board having high heat dissipation characteristic by providing a thermal conductive base part, electric insulating thermal conductive bottom part layer which is essentially arranged on the base part on a surface, and at least two separate layers of a conductive circuit lead line for interconnecting the circuit parts CONSTITUTION: A multilayer heat dissipation circuit board 40 is provided with a base part board 70, constituted of high thermal conductive materials The base part board 70 is provided with a bottom part insulating layer 72, constituted of thermal conductive dielectric epoxy for preventing electric contact between the base part board 70 an the upper arranged layer of the circuit A plurality of alternate layers of conductive strips and selectively arranged interposed insulating layers are positioned on the insulating layer 72, and the prescribed strip in each conductive layer is separated from the strip in another conductive layer by an insulating means On the other hand, predetermined positions between the conductive strips in the different layers are exposed, so that electric contact can be made The several conductive strips are formed by using a conductive ink, and the insulating and conductive layers are applied by using a silk screening

Method of manufacturing a printed wiring board

Abstract: A method of manufacturing a printed wiring board A comprises the steps of providing a double-sided copper clad laminate 1; embedding a conductive ink 5 into a through hole 4 provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate 1 to copper electroplating to form a copper plated layer 6 after curing the conductive ink 5, which layer 6 extends over ink 5; and forming a circuit land 7 and circuit by removing material eg by etching The method may be used in manufacturing multilayer wiring boards

Mounting method of semiconductor component

Abstract: PURPOSE:To mount a semiconductor component accurately to a printed circuit board, in which a wide wiring pattern such as a power line and a narrow wiring pattern such as a signal line are mixed. CONSTITUTION:When bumps 2a, 2b formed to the electrodes of a semiconductor chip 1 are abutted against corresponding wiring patterns 3a, 3b composed of conductive ink printed on a printed circuit board 4 and the semiconductor chip 1 is connected electrically to the printed circuit board 4, the wiring pattern 3a having board line width in the wiring patterns 3a, 3b on the printed circuit board 4 side is formed by printing narrow wiring patterns 3a1, 3a2 consisting of conductive ink in parallel at an interval A2 of a limiting minimum interval or less capable of separating lines by printing.

Process for making ceramic insulated supports by piling up layers.

Abstract: of EP0562977Process for manufacturing insulating ceramic inserts which are used as sealed passages for electrical conductors through a metal wall, consisting in silk-screen printing a green-ceramic sheet using a conductive ink in patterns which are generally in the form of a ring, in pressing the patterns, in drilling holes in the centre of the ring and in at least one other green sheet, in laying and pressing the silk-screen-printed sheet against at least one, or between two, other green sheet, or sheets, by bringing the holes into coincidence, in making a cut around each hole, in metallizing the outer lateral surface of the component obtained, and in heat treating in order to fire and sinter, the sintering thus being able to be carried out before metallizing the outer lateral surface.