Showing papers on "Electronic packaging published in 1970"
01 Jan 1970
4 citations
TL;DR: Metallization systems materials for IC, discussing environmental stability, metals electromigration, electrochemical corrosion tests, etc as discussed by the authors, and discuss environmental stability and metal electromigration in IC.
Abstract: Metallization systems materials for IC, discussing environmental stability, metals electromigration, electrochemical corrosion tests, etc
4 citations