Showing papers on "Electronics cooling published in 1995"

The evolution of IBM high performance cooling technology

Abstract: This paper provides a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large-scale computers over the past 25 years. Package cooling technology and its evolution, leading to the development of the thermal conduction module (TCM) is described. The development of air cooling technology is discussed; along with enhancements using turbulators, air-to liquid heat exchangers, and impinging flow. The development of water cooling and direct liquid immersion technology is also covered.

Thermal placement for high-performance multichip modules

Abstract: A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.

Design Of The Interface Electronics For An Integrated Microsensor For The Preventive Detection Of Water Condensation

Abstract: We are developing a new type of integrated microsensor for the preventive detection of water condensation. The sensor operation is based on a thermal oscillation generated by Peltier effect at a junction. When water droplets form upon cooling of the junction sensitive area, the thermal oscillation is perturbed, resulting in its frequency shifts. This shift allows us to determine in advance the conditions for mist formation. To operate the microsensor, we designed an interface electronics able to generate and control the thermal oscillation. For the acquisition and processing of the sensor output signal, we investigated two complementary approaches: a dynamic differential scheme and a sampling-predicting circuit.

Green design on thermal management of notebook computer product

Abstract: Natural cooling, where no auxiliary equipment is required, is the way toward the green design of the product. Generally, heat transfer by natural convection is more efficient if an unobstructed flow path is made available. Experiments show that the heat transfer of a vertical oriented configuration is much better than of a horizontal configuration. Therefore, vertical configuration is a good candidate to accomplish the green design. Three novel vertical oriented designs are proposed, the assembly and ergonomic concept are also included in this design. With the special installation mechanism, it is easy to set up the system. This configuration successfully shows a environmental attributes design for product use.

Heat transfer studies of a flow-through module for electronics cooling

Abstract: : The thermal performance characteristics of an electronics cooling Liquid Flow Through Module (FTM) were experimentally investigated Different sets of experiments were conducted for each side of the FTM A synthetic dielectric polyalphaolefin type coolant, Brayco Micronic 889, was used Six etched foil type heaters were attached to one side of the FTM over the fluid flow path while three heaters were attached to the other side of the module Inlet and outlet fluid temperatures as well as surface temperature data were acquired from both sides of the module for several different flow rate and power setting combinations to quantify the effectiveness of the FTM Correlations, in terms of Reynolds and Stanton numbers were formulated according to the data for both sides of the module (MM)