Showing papers on "Flexible electronics published in 1989"

Touch screen overlay with improved conductor durability

Abstract: A touch screen overlay for use on the viewing surface of a visual display device formed from a flexible membrane laminate having improved conductor durability. The flexible laminate comprises first and second flexible substrates formed of transparent polyester material. An array of parallel transparent conductors is deposited on a surface of each flexible substrate. The two flexible substrates are joined together by an adhesive sheet of polyester material. The substrates are joined so that transparent conductors are deposited on the surface of each flexible substrate which faces away from the viewing surface when the overlay is attached to the visual display device. The two arrays, when so superimposed, form a grid-like pattern, separated by the thickness of the upper one of the flexible substrates and the adhesive sheet. A third flexible substrate also formed of polyester material covers the surface of the upper one of the other flexible substrates carrying the upper array of parallel conductors. The second and third flexible substrates are also joined by an adhesive sheet of polyester material. When the overlay is contacted either by finger touch or by a stylus, the transparent conductors located in the laminated below the contact area will subjected substantially only to compression forces.

Flexible printed circuit board

Abstract: A flexible printed circuit board of band shape installed within a tubular or hollow polygonal prismatic casing along the circumferential direction of the casing is composed of at least two flat areas formed in the flexible printed circuit board, and circuit elements mounted on the flat areas

Flexible base materials for printed circuits

Abstract: Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.

Compact package for electronic module

Abstract: A very compact package for an electronic data module, which includes battery-backed memory. A two-part metal container is used, which has two shallow concave pieces which fit together. The integrated circuit (in a low-height package, such as a flat-pack or SOIC) is mounted on a very small flexible printed circuit board, which fits inside the container. Laterally spaced from the integrated circuit, on the other end of the small flexible board, the board end is sandwiched between a battery and a piece of elastic conductive material (such as conductive plastic foam). Thus, the battery is connected between one face of the container and a power conductor on the board. The piece of elastic conductive material makes contact between a data trace on the board and the other face of the container. Another trace on the board makes contact directly to the container face on which the battery's ground terminal is connected. Thus, simple wiring on the small board, using through-hole vias, suffices to route power, ground, and data lines to the integrated circuit, while providing a sealed durable package with two external contacts.

Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board

Abstract: The flexible printed circuit device, includes at least one hybrid circuit structure having assigned contact areas, a rigid printed circuit board, a flexible printed circuit board portion also having assigned contact areas on one end region thereof and being connected electrically to the rigid printed circuit board, a plurality of bonding electrical conductors, each of the electrical conductors being bonded at one end thereof to one of the assigned contact areas on the at least one hybrid circuit structure and, at the other end thereof, to one of the assigned contact areas on the end region of the flexible printed circuit board portion; and a rigid support, the hybrid circuit structure being mounted on the rigid support. The end region of the flexible printed circuit board portion is fixedly mounted on the rigid support in side-by-side relationship with the hybrid circuit structure. A protective frame is provided enclosing the electrical conductors electrically connecting the assigned contact areas on the hybrid circuit structure and the end region of the flexible printed circuit board portion.

Flexible printed circuit

Abstract: A flexible printed circuit having contacts and associated leads which are connected to the contacts. The contacts are disposed at a first zone and the leads are for connection from this zone to a second zone of the circuit which is at a distance from the first zone. The leads run from the respective contacts substantially perpendicular to the axis of the printed circuit which connects the two zones. The leads in turn form bends or loops in relation to the axis, up to the second zone.

Miscible blends of imide containing polymers with poly(aryl sulfones)

Abstract: This application relates to miscible blends of biphenyl containing poly(aryl sulfones) and isopropylidene based polyimides. These blends are suitable for printed wiring board substrates, flexible printed circuit boards, electrical connectors and fabricated articles requiring heat and chemical resistance. A method for extruding these articles is taught.

Flexible printed circuit, particularly for electronic microcircuit cards, and card incorporating this circuit

Abstract: The subject of the invention is a printed circuit (10) provided with conductors (14) connected to distributed contacts (15) in a first zone of the printed circuit and intended for a connection made in a second zone distant from the first. … It is characterised in that the conductors (14) leave respective contacts (15) substantially perpendicularly to the axis (A) of the printed circuit joining the two zones and subsequently form loops or bends relative to this axis, up to the second zone. … …

Flexible printed circuit board

Abstract: A flexible printed circuit board including an insulating flexible substrate, a plurality of first conductive terminals disposed on a front surface of said substrate for external connections, said first terminals to be glued and connected to a plurality of different conductive terminals of a different circuit board by an anisotropic conductive adhesive, and a plurality of conductive patterns disposed on a rear surface of said substrate.

Printed circuit assembly with contact dot

Abstract: A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.

Printed Circuit Engineering: Optimizing for Manufacturability

Abstract: 1. Introduction To Standards and Specifications.- 2. Understanding Blueprints.- 3. Processes And Tolerances.- 4. Artwork Inspection.- 5. Planning: Multilayer And Double Sided Printed Circuits.- 6. Planning Flex And Rigid-Flex Jobs.- 7. Aspects Of Quality Assurance.- A. MIL-STD-275E: Printed Wiring for Electronic Equipment.- B. IPC-D-300G: Printed Board Dimensions and Tolerances.- C. MIL-P-55110D: General Specification for Printed Wiring Boards.- D. IPC-A-600C: Guidelines for Acceptability of Printed Boards.- E. MIL-P-13949F: Plastic Sheet, Laminated, Metal Clad (For Printed Wiring Boards).- F. MIL-STD-2118: Design Requirements for Flex and Rigid-Flex Printed Wiring for Electronic Equipment.

Sealing arrangement for a lamp housing

Abstract: A sealing arrangement for a flexible printed circuit fixed to a lamp housing and feeding electrical current to a lamp bulb assembly connected to the lamp housing characterized in that the lamp housing and the lamp socket assembly each support a sealing gasket which engages the flexible printed circuit outboard of the electrical connection between the terminals of the lamp socket assembly and the printed circuit.

Connecting method for printed circuit board

Abstract: PURPOSE:To improve the efficiency of heat transfer, to melt solder rapidly and positively and to conduct soldering excellently by forming a through-hole at the terminal section of one printed circuit board and connecting both circuit boards. CONSTITUTION:A solder resist 7 is applied to sections except a terminal section 3a and solder 9 is attached to the terminal section 3a on the rigid printed circuit board 1 side on connection. On the other hand, terminal sections 6a are shaped onto both surfaces of an insulating film 5 while through-holes 10 are formed respectively to each terminal section 6a on the flexible printed circuit board 4 side, and solder 9 is annexed onto the whole surfaces of the terminal sections 6a including the internal surfaces of the through-holes 10. When the terminal sections 3a and 6a of both circuit boards 1, 4 are superposed under the state and heat is applied from at least the flexible printed circuit board 4 side, solder 9 held between both terminal sections 3a, 6a is also heated efficiently by heat conduction in a metal, and melted sufficiently.

Photovoltaic array environmental protection program

Abstract: During the photovoltaic array environmental protection program, a coating material, application technique, and design approach intended to protect flexible solar array blankets during a nominal fifteen-year operating lifetime were developed. Numerous thin-film coatings for protecting the Kapton polyimide material used in the construction of the Space Station Freedom flexible solar array blanket were evaluated. The critical solar array design features and protection measures are discussed with special emphasis on the effects of solar array fabrication and flexible printed circuit manufacturing processes on coating durability. The results of the mechanical and environmental test evaluation, including oxygen plasma, neutral oxygen beam, and UV/charged-particle combined exposure, are discussed. These results led to the selection of a silicon dioxide thin-film coating to protect the solar array blanket from the low-earth-orbit atomic oxygen environment. >

Flexible printed wiring board

Abstract: PURPOSE:To improve adhesion, heat resistance and moisture resistance by forming a metallic deposit onto the surface of a specific plastic film and laminating the metallic layer of a thick-film onto the metallic deposit through an electroplating method. CONSTITUTION:Metallic deposits 4 are shaped onto the surface 2 of a plastic film 1 given surface tension of 54dyne/cm or more directly or through a resin layer 3 through glow discharge plasma treatment, and the metallic layers 5 of thick-films are laminated onto the metallic deposits 4 through an electroplating method, and unified. When the surface tension of the plastic film is less than 54dyne/cm, adhesion and flexibility cannot be made to coexist, and a defect is generated in a change into a fine pattern and the test of high temperature and humidity. There is no limitation in an upper limit, but the surface tension of 78dyne/cm or less of water is more preferable from the points of moisture resistance and boiling water resistance. Acoordingly, a flexible printed circuit board, which is not peeled even through a severe environmental test and has excellent adhesion, can be manufactured.

Connecting structure for flexible printed circuit substrate

Abstract: PURPOSE:To always preferably maintain the contact state of both contacts by so pressuring from behind the contact by an elastic member as to bring the contact of a flexible printed circuit substrate into contact with the contact of an external circuit. CONSTITUTION:Since the contact 12 of a flexible printed circuit substrate 1 is pressurized from behind by an elastic member 4, the contact force of the contact 12 with the contact 22 of a printed circuit substrate Z can be sufficiently obtained. Accordingly, Preferable conductivity can be obtained without gold plating the contacts 12, 22. The electrically connecting state of both the contacts 12, 22 can be effectively maintained even under severe using conditions by a vibration or the like. Particularly, since the contact 12 is pressurized in a state that a protrusion 41 formed at the end of an elastic member 4 is brought into contact with the inner depth part of the recess 13 of the substrate 1, the pressurizing force of the member 4 can be directly operated to the contact 12. As a result, the contacts 12, 22 can be effectively brought into contact.

Connection structure of flexible printed circuit board

Abstract: PURPOSE:To decrease the space and cost of connecting/part, by placing each printed circuit board at the specified distance and with the corresponding connecting part opposed, coupling said printed circuit boards with a coupler, and making said boards conductive through a conductive elastic connecting member CONSTITUTION:Flexible printed circuit boards 1 and 2, comprising conductor circuits 12 and 22 formed on the surface of insulating base films 11 and 21, are placed opposingly at the specified distance Connecting parts 13 and 23 are made of such material as copper leaf A needle coupler 4 pierces the parts close to the connecting parts of the base films 11 and 21 A compressed conductive elastic material 3 is placed between the opposed connecting parts 13 and 23 to decrease the contact resistance This enables steady connecting the printed circuit boards with each other to decrease the area of contacting part and lower the cost of connection

Flexible printed-circuit board

Abstract: PURPOSE:To enhance reliability of a face-mounting operation by a method wherein a reinforcement sheet composed of aluminum is bonded, by using a heat-resistant adhesive, to the rear of an insulating flexible substrate which is used to mount an electronic component for surface-mounting use by a reflow soldering operation and on which a conductive pattern has been formed. CONSTITUTION:Conductive patterns 2 composed of copper foil are installed on an insulating flexible substrate 1 composed of a polyimide film or the like. A reinforcement sheet 3 composed of aluminum is bonded to the rear of the flexible substrate 1 by using a heat-resistant adhesive 4. A solder 7 is printed or coated on the conductive patterns 3 of a flexible printed-circuit board 6; a PLCC-type LSI 8 and an electronic component 9 for surface-mounting use are mounted by a reflow soldering operation by making use of the cleamy solder 7. At the flexible printed-circuit board 6 covered with the reinforcement sheet 3 composed of aluminum, an overall temperature at an underside of the PLCC-type LSI 8 is nearly uniform during the reflow soldering operation; the cleamy solder 7 is melted surely; the good reflow soldering operation can be executed.

Material of flexible printed circuit board

Abstract: PURPOSE:To obtain relatively low cost flexible printed circuit board material with excellent heat-resistant property, flame-retardant property and dimensional stability and free from voids and interlayer delamination by a method wherein a polyethersulfone film is subjected to a corona discharge treatment or a plasma treatment to obtain a surface wetting tension not less than a specific value and a metal foil is bonded to the film with heat-resistant adhesive. CONSTITUTION:A polyethersulfone film is subjected to a corona discharge treatment or plasma treatment to obtain a surface wetting tension not less than 42dyne/cm and a metal foil, typically a copper foil, is bonded to the film with heat-resistant adhesive. Needless to say, the metal foils may be applied to not only one side of the film but also both sides of the film. The polyethersulfone film with a thickness of 4-300mum is employed. If the film is too thin, the physical strength is not sufficient and, if the film is too thick, the flexibility is not sufficient. The preferable thickness range is 15-50mum. As the heat-resistant adhesive, thermosetting type epoxy resin system or acrylic resin system is recommended.

Active matrix type liquid crystal display panel

Abstract: PURPOSE:To lessen an increase in electric resistance or generation of disconnections by forming terminals to be connected to an external circuit in such a manner as to have the laminated structure of at least two layers among conductive films forming signal electrode wires, scanning electrode wires and picture element electrodes. CONSTITUTION:The connecting electrode terminal 70 of the signal electrode wire has the two-layered structure consisting of the conductive film 61 forming the scanning electrode wire and the conductive film 64 forming the signal electrode wire. Such connecting terminal 70 and the connecting terminal 71 of a flexible printed circuit board 65 formed with the external circuit are connected via an anisotropic conductive film 66. Gaps D, E may be formed in some cases between a substrate 40 and the flexible printed circuit board 65 without packing of sealants 80, 81 therein. However, the connecting terminals have the two- layered structure according to this display panel and, therefore, the terminal parts are hardly disconnected even if said parts are corroded by moisture.

Flexible printed circuit board and manufacture thereof

Abstract: PURPOSE: To obtain a flexible printed circuit which is free from curls and wrinkles and is superior in heat-resistance and fire-resistance by combining resin faces of a two layer flexible printed circuit board which is obtained by applying a heat-resistant resin on the face of a metallic foil after directly spreading and extending its heat-resistance resin without using adhesives. CONSTITUTION: A polyamic acid solution is applied on the face of a metallic foil after directly spreading and extending its solution and a resultant resin layer makes its solution to be formed into a film and yet, it does not set completely. Etching of a circuit pattern is performed in accordance with an ordinary process to a circuit board which is obtained by heating it up to a temperature of 150-300°C. After that, a resin is put on top of the other resin face and they are heated at a temperature of 300-450°C and are pressed under a pressure of 1-100kg/cm 2 , The circuit board which is free from curls and wrinkles and is superior in heat-resistance and fire-resistance is thus obtained. COPYRIGHT: (C)1990,JPO&Japio

Device for coupling and connecting, to an electrical appliance, an electronic power module

Abstract: The invention relates to a device for coupling and connecting, to an electrical appliance, an electronic power module of the type comprising a metal support on which are directly attached the power components and a thin flexible printed circuit which is assembled rigidly in a zone defining the module. The device according to the invention is characterised in that the flexible printed circuit 2 extends beyond the zone defining the power module and, because of its shape and its flexibility, allows coupling to the various consumers which are to be associated with the various outputs of the said module and in that the flexible printed circuit 2, 17, 13 comprises ports (windows) allowing coupling of the power chips mounted directly on the associated metal support. Application to the automobile industry.

Connection apparatus and connection of flexible printed-circuit board

Abstract: PURPOSE:To enhance the bonding strength between a board and a part to be connected and to easily and surely align conductors by a method wherein plural wiring conductive layers at a curved part of a flexible printed-circuit board are soldered to plural conductors at the corresponding part to be connected. CONSTITUTION:When a flexible printed-circuit board 2 is connected to a rigid printed-circuit board 1, a solder 4 is coated on either a wiring conductive layer 2b on the side opposite to an end of the board 2 at a curved part 2A of the board 2 or a wiring conductive layer 1b of the board 1 or no both of them; they are faced to each other and aligned; after that, they are pressure-bonded face to face. Then, they are put in a heating furnace; they are heated from the side of a U-shaped part between a tip of the curved part 2A and the board 1; the solder between the layers 2b and 1b is melted; they are taken out of the furnace, cooled and hardened.

Flexible printed circuit board for a camera

Abstract: The invention relates to a flexible printed circuit board assembly for a camera, comprising an annular lens guide ring (24) adapted to be moved linearly along the optical axis of the lens. The annular guide ring (24) has at least one elongated groove (82) for retaining a flexible printed circuit board (81) positioned within said groove (82).

Flexible printed circuit board

Abstract: PURPOSE:To obtain a flexible printed circuit(FPC) board excellent in a heat resistance, a dimensional stability, and a bending resistance by a method wherein the board is composed of a plastic polyether ketone resin biaxially oriented film specified in a thermal shrinkage factor and elongation at break. CONSTITUTION:A polyether ketone resin is formed in a biaxial orientation, which needs to have such properties that the thermal shrinkage factor is 1.0% or less when it is heated at a temperature of 280 deg.C for two hours and 3.0% or less when heated at 200 deg.C for five minutes, and the breaking extension is 10% more when it is heated at a temperature of 280 deg.C for 500 hours. It needs to have flexibility as a FPC, but if its elongation at break is less than 10%, it is easy to get cracked when bent because it is small in toughness when it is used as a FPC. By these processes, a flexible printed circuit board excellent in a heat resistance, a bending resistance, and a dimensional stability can be obtained.

Connecting structure for flexible printed circuit substrate

Abstract: PURPOSE:To provide excellent operability and to remove a flexible printed circuit substrate even after it is connected by providing a styluslike terminal at a connector, penetrating the conductor circuit of the flexible printed circuit substrate to the terminal, and electrically connecting both the substrates. CONSTITUTION:In order to connect both flexible printed circuit substrates by a connecting structure of the printed circuit substrates, folded parts 23 are so inserted to styluslike terminals 14 provided in the connector 13 of the substrate 1 as to match conductor circuits 22 to the terminals 14 in a state that a cap 15 is opened, and the cap 15 is then closed. Thus, since the terminals 14 are penetrated through a plurality of insulation base films 21 and the circuits 22, the folded parts 23 are electrically and mechanically effectively connected to the terminals 14. Further, the cap 15 is closed in the state contacted with or inserted to the end of the terminal 14, it can effectively prevent the film 21 from removing from the terminal 14.

Manufacturing method of printed circuit boards.

Abstract: of EP0299453The invention relates to a method for producing printed circuits in a rigid/flexible multilayer technique, the printed circuit being able to have one or more flexible regions, each of which comprises one or more flexible planes. In order to be able to insert such printed circuits in an angled configuration in a holder, after manufacture, such that there are no mechanical stresses whatsoever, according to the invention, the different lengths of the flexible planes provided, which are required for the subsequent configuration of the angled rigid/flexible circuit, are taken into account even at the layout creation stage, so that the circuit intrinsically assumes (that is to say, without any additional mechanical bending stress) its subsequent physically provided configuration.

Active liquid crystal display panel

Abstract: PURPOSE:To reduce a gate pass giving circuit and to economize the title panel as a whole by connecting each gate pass of first and second display parts to one by using a connecting member. CONSTITUTION:An end edge of the side where a gate pass driving COF33 of a transparent substrate 11 is projected in the same way as other end edge, and gate passes X1-X2n are extended to its projecting part. The gate pass Xi of the first display part 1a and the gate pass Xn+i or X2n+1-i of the second display part 1b which are extended are connected by conductors which are formed on an FPC (flexible printed circuit) 36. In such a way, one gate pass driving COF33 or 34 of the first and the second display parts which are neces sary up to the present can be reduced. Also, said connecting member is simple in its constitution and low in its cost, therefore, the title panel goes to extremely more economical than before as a whole.

Matrix display device

Abstract: PURPOSE:To facilitate the installation to a curved surface-like core material by mounting plural light emitting elements in a matrix shape to a circuit pattern which has been formed on a flexible printed circuit board, curving said board and installing it to the core material. CONSTITUTION:Plural light emitting elements 14 are mounted in a matrix shape to a circuit pattern which has been formed on a flexible printed circuit board 10. This flexible printed circuit board 10 is installed to a core material 21 by turning each light emitting element 14 to the outside, and also, curving its board surface. The flexible printed circuit board 10 can be also be constituted so that it is divided into plural block units for covering partially each the installation surface of the core material 21.

Multilayer flexible printed wiring board using plural terminal rows

Abstract: PURPOSE:To be easily detachably attach without deformation of a terminal to a connector sold in a market and to alleviate a connecting work by superposing many flexible printed circuit boards each having a thick terminal conductor protruding from the end of the circuit board, inserting a reinforcing plate to the root of the terminal, and so adhering as to become desired number of connections. CONSTITUTION:In two or more layer multilayer flexible printed circuit boards, terminals 3 protruding continuously from circuit conductors of layers are provided at the end, and an insulating reinforcing plate 4 is provided between a circuit conductor continued to the terminal 3 of one layer at the end from which the terminal 3 protrudes and the circuit conductor continued to the terminal 3 of the other layer. Thus, when the terminal of the flexible printed wiring board is inserted to the connector, the deformation of the terminal is prevented, thereby enabling a sure and easy connection of the board.