The use of adhesive bonding in joining of materials with different characteristics is of major importance in a variety of microelectronic and photonic applications. The curing of such adhesives is also of great consequence, with the use of optical radiation for adhesive curing becoming the method of choice in various applications, especially bonding of components in microelectronics and fiber–optic assembly. This article reviews recent advances in the development of adhesives, their applications, and their curing methods using optical radiation; it also includes a brief overview of the adhesion mechanisms.

Adhesive bonding in microelectronics and photonics

This study describes stress and failure analyses of tensile loaded repaired Carbon Fibre Reinforced Composite (CFRP) laminates, using scarf configuration. A numerical model including interface finite elements was used to obtain peel and shear-stress distributions in the directions tangent and normal to the scarf. These stresses were evaluated at several locations in the repair, namely in the middle of the adhesive, at interfaces between adhesive and patch, and between adhesive and parent material. Several scarf angle values were considered in the analysis. A cohesive mixed-mode damage model was also used to carry out the failure analysis, in order to assess the efficiency of the repairs, for different stacking sequences. A study was performed to evaluate the influence of the mechanical properties of the adhesive and parent laminate/adhesive and adhesive/patch interfaces on the strength and failure modes of the joint. It was concluded that the strengths of the adhesive and interfaces are more important tha...

Stress and failure analyses of scarf repaired CFRP laminates using a cohesive damage model

https://afendirojan.files.wordpress.com/2010/04/strength-prediction-of-epoxy-adhesively-bonded-scarf-joints-of-dissimilar-adherends.pdf

Strength prediction of epoxy adhesively bonded scarf joints of dissimilar adherends

Effect of adhesive thickness on fatigue and fracture of toughened epoxy joints – Part II: Analysis and finite element modeling

Fracture toughness of rubber-modified epoxy adhesives: effect of plastic deformability of the matrix phase

Most of adhesively bonded joints are under complicatedly distributed triaxial stress in the adhesive layer. For the estimating of the strength of adhesively bonded joints, it is crucial to clarify behavior of yield and failure of the adhesives layer under triaxial stress conditions. Two types of the adhesively bonded joints were used in this study: One is the scarf joint which is under considerably uniform normal and shear stresses in the adhesive layer, where their combination ratio can be varied with scarf angle. The other is the butt joint with thin wall tube in which considerably uniform pure shear can be realized in the adhesive layer under torsional load conditions. These joints can cover the stress triaxiality in adhesive layers of most joints in industrial application. The effect of stress triaxiality on the yield and fracture stresses in the adhesive layer were investigated using the joints bonded by three kinds of adhesives in heterogeneous and homogeneous systems. The results showed that both the yield and failure criterion depend on the stress triaxiality and that the fracture mechanism of the homogeneous adhesive is different from that of the heterogeneous one. From these experimental results, a method of estimating the yield and failure stresses was proposed in terms of a stress triaxiality parameter.

A. Fujinami

Papers

Fracture and yield behavior of adhesively bonded joints under triaxial stress conditions