Diamond thin films have outstanding optical, electrical, mechanical and thermal properties, which make these attractive for applications in a variety of current and future systems. In particular, t...

A review of nucleation, growth and low temperature synthesis of diamond thin films

Chemically vapour deposited diamond coatings on cemented tungsten carbides : Substrate pretreatments, adhesion and cutting performance

Diamond coatings on cemented tungsten carbide tools by low-pressure microwave CVD

A study of diamond film deposition on WC–Co inserts for graphite machining: Effectiveness of SiC interlayers prepared by HFCVD

Diamond coatings up to ∼60-μm thick have been grown by microwave plasma CVD (MPCVD) on sintered tungsten carbide (WC) substrates, and their erosive wear properties are investigated under high velocity air–sand erosion testing. Two different sintered tungsten carbide (WC) substrates have been investigated and compared, the binder being either 6% Co or 5% Ni by weight. Significant differences in morphology, residual stress, adhesion and erosion performance are seen as a function of pre-deposition treatment, deposition conditions and the source of the substrates. Adherent coatings could be deposited to a thickness of ∼35 μm. They offer significantly better erosion resistance compared to uncoated substrates, with the erosion rate being lowered by up to a factor between ∼5 and 20 for particle test velocities of 148 and 63 m s−1, respectively. The steady-state erosion rates of the coatings are a function of a gradual micro-chipping mechanism. However, the life of the coating is dependent on the progression of sub-surface damage promoted by sub-surface shear stresses associated with the particle impacts. It is thought that the coating debonding is driven by the shear stresses interacting with the grain boundary porosity at the substrate/coating interface.

A. Leonhardt

Papers

Interlayers for diamond deposition on tool materials