A
Aaron Scott Lukas
Researcher at Air Products & Chemicals
Publications - 35
Citations - 1465
Aaron Scott Lukas is an academic researcher from Air Products & Chemicals. The author has contributed to research in topics: Dielectric & Chemical vapor deposition. The author has an hindex of 13, co-authored 35 publications receiving 1464 citations.
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Patent
Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure
Aaron Scott Lukas,Mark Leonard O'neill,Jean Louise Vincent,Raymond Nicholas Vrtis,Mark Daniel Bitner,Eugene Joseph Karwacki +5 more
TL;DR: In this paper, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties compared to the as-deposited film.
Patent
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
Raymond Nicholas Vrtis,Mark Leonard O'neill,Jean Louise Vincent,Aaron Scott Lukas,Manchao Xiao,John Anthony Thomas Norman +5 more
TL;DR: A porous organosilica glass (OSG) as discussed by the authors is a single phase of a material represented by the formula Si v O w C x H y F z, where v+w+x+y+z=100, w is from 10 to 65 atomic %, x is from 5 to 30 atomic % and y is from 0 to 50 atomic %.
Patent
Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants
Raymond Nicholas Vrtis,Mark Leonard O'neill,Jean Louise Vincent,Aaron Scott Lukas,Manchao Xiao,John Anthony Thomas Norman +5 more
TL;DR: In this article, a method for providing a porous organosilica glass (OSG) film that consists of a single phase of a material represented by the formula SivOwCxHyFz, v+w+x+y+z=100, v is from 10 to 35 atomic %, w is from 20 to 65 atomic % and x is from 5 to 30 atomic %.
Patent
Non-thermal process for forming porous low dielectric constant films
Aaron Scott Lukas,Mark Leonard O'neill,Mark Daniel Bitner,Jean Louise Vincent,Raymond Nicholas Vrtis,Eugene Joseph Karwacki +5 more
TL;DR: In this paper, a low-temperature process to remove at least a portion of at least one pore-forming phase within a multiphasic film and forming a porous film is described.
Patent
Materials and methods of forming controlled void
Raymond Nicholas Vrtis,Dingjun Wu,Mark Leonard O'neill,Mark Daniel Bitner,Jean Louise Vincent,Eugene Joseph Karwacki,Aaron Scott Lukas +6 more
TL;DR: In this paper, the authors present a process for forming an air gap within a substrate, the process comprising: providing a substrate; depositing a sacrificial material by deposition of at least one sacrificial materials precursor; removing the porogen material in the composite layer to form a porous layer and contacting the layered substrate with a removal media to substantially remove the sacrificialmaterial and provide the air gaps within the substrate.