Silicon photonics is advancing rapidly in performance and capability with multiple fabrication facilities and foundries having advanced passive and active devices, including modulators, photodetectors, and lasers. Integration of photonics with electronics has been key to increasing the speed and aggregate bandwidth of silicon photonics based assemblies, with multiple approaches to achieving transceivers with capacities of 1.6 Tbps and higher. Progress in electronics has been rapid as well, with state-of-the-art chips including switches having many tens of billions of transistors. However, the electronic system performance is often limited by the input/output (I/O) and the power required to drive connections at a speed of tens of Gbps. Fortunately, the convergence of progress in silicon photonics and electronics means that co-packaged silicon photonics and electronics enable the continued progress of both fields and propel further innovation in both.

Perspective on the future of silicon photonics and electronics

Direct epitaxial integration of III-V materials on Si offers substantial manufacturing cost and scalability advantages over heterogeneous integration. The challenge is that epitaxial growth introduces high densities of crystalline defects that limit device performance and lifetime. Quantum dot lasers, amplifiers, modulators, and photodetectors epitaxially grown on Si are showing promise for achieving low-cost, scalable integration with silicon photonics. The unique electrical confinement properties of quantum dots provide reduced sensitivity to the crystalline defects that result from III-V/Si growth, while their unique gain dynamics show promise for improved performance and new functionalities relative to their quantum well counterparts in many devices. Clear advantages for using quantum dot active layers for lasers and amplifiers on and off Si have already been demonstrated, and results for quantum dot based photodetectors and modulators look promising. Laser performance on Si is improving rapidly with ...

Perspective: The future of quantum dot photonic integrated circuits

Laser gain regions using quantum dots have numerous improvements over quantum wells for photonic integration. Their atom-like density of states gives them unique gain properties that can be finely tuned by changing growth conditions. The gain bandwidth can be engineered to be broad or narrow and to emit at a wide range of wavelengths throughout the near infrared. The large energy level separation of the dot states from the surrounding material results in excellent high-temperature performance and gain recovery at sub-picosecond timescales. The fact that the quantum dots are isolated from each other and act independently at inhomogeneously broadened wavelengths results in ultralow linewidth enhancement factors, highly stable broadband mode-locked lasers, single-section mode locking, and the possibility of reduced crosstalk between amplified signals at low signal injection and enhanced four-wave mixing at high signal injection. The high carrier confinement and areal dot density provide reduced sensitivity to crystalline defects allowing for long device lifetimes even when epitaxially grown on silicon at high dislocation densities.

A Review of High-Performance Quantum Dot Lasers on Silicon

Quantum dot lasers epitaxially grown on Si are promising for an efficient light source for silicon photonics. Recently, considerable progress has been made to migrate 1.3 μm quantum dot lasers from off-cut Si to on-axis (001) Si substrates. Here, we report significantly improved performance and reliability of quantum dot lasers enabled by a low threading dislocation density GaAs buffer layer. Continuous-wave threshold currents as low as 6.2 mA and output powers of 185 mW have been achieved at 20 °C. Reliability tests after 1500 h at 35 °C showed an extrapolated mean-time-to-failure of more than a million hours. Direct device transparency and amplified spontaneous emission measurements reveal an internal optical loss as low as 2.42 cm–1 and injection efficiency of 87%. This represents a significant stride toward efficient, scalable, and reliable III–V lasers on on-axis Si substrates for photonic integrate circuits that are fully compatible with CMOS foundries.

Highly Reliable Low-Threshold InAs Quantum Dot Lasers on On-Axis (001) Si with 87% Injection Efficiency

https://iopscience.iop.org/article/10.1088/1361-6641/aad655/pdf

How to control defect formation in monolithic III/V hetero-epitaxy on (100) Si? A critical review on current approaches

As a promising integration platform, silicon photonics need on-chip laser sources that dramatically improve capability, while trimming size and power dissipation in a cost-effective way for volume manufacturability. Currently, direct heteroepitaxial growth of III–V laser structures on Si using quantum dots as the active region is a vibrant field of research, with the potential to demonstrate low-cost, high-yield, long-lifetime, and high-temperature devices. Ongoing work is being conducted to reduce the power consumption, maximize the operating temperature, and switch from miscut Si substrates toward the so-called exact (001) Si substrates that are standard in microelectronics fabrication. Here, we demonstrate record-small electrically pumped micro-lasers epitaxially grown on industry standard (001) silicon substrates. Continuous-wave lasing up to 100°C was demonstrated at 1.3 μm communication wavelength. A submilliamp threshold of 0.6 mA was achieved for a micro-laser with a radius of 5 μm. The thresholds and footprints are orders of magnitude smaller than those previously reported lasers epitaxially grown on Si.

1.3 μm submilliamp threshold quantum dot micro-lasers on Si

Heterogeneous silicon photonics is uniquely positioned to address the photonic sensing needs of upcoming autonomous cars and provide the necessary cost reduction for widespread deployment. This is because it allows for wafer-scale active/passive integration, including optical sources. We present our recent research and the development of interferometric optical gyroscopes and LiDAR sensors. More specifically, we show a fully integrated gyroscope front-end occupying an area of only 4.5 mm2. We also show the first dense pitch optical phased array using heterogeneous phase shifters. The 4 µm pitch heterogeneous phase shifters provide very low V2π of only 0.35-1.4 V across 200 nm, low residual amplitude modulation of only 0.1-0.15 dB for 2π phase shift, extremely low static power consumption ( 1 GHz). All of these factors make them ideal for next-generation LiDAR systems that employ optical phased arrays.

Heterogeneous silicon photonics sensing for autonomous cars.

Mid-infrared (MIR) silicon photonic systems show great promise for miniaturizing a variety of sensing and detection technologies. Rapid progress has been made in recent years, and numerous passive and active MIR devices have now been constructed on various silicon-based platforms. We previously reported the heterogeneous integration on silicon of Fabry–Perot and distributed feedback quantum cascade lasers (QCLs) operating at 4.8 μm. Interband cascade lasers (ICLs) will be preferred for many on-chip sensing technologies because they operate in the 3–6 μm range with threshold drive powers 1–2 orders of magnitude lower than QCLs. In this work, we demonstrate the integration of ICLs on a silicon substrate. These lasers emit 3.6 μm light into silicon-on-insulator waveguides in pulsed mode at temperatures up to 50°C. This represents an important step toward MIR photonic integrated circuits on silicon that operate with much lower drive power and therefore an even smaller footprint.

Interband cascade laser on silicon

High gain and high saturation output power silicon-based semiconductor optical amplifiers (SOAs) are essential elements in future large-scale silicon photonic integrated circuits (PICs) to compensa...

Alfredo Torres

Papers

1.3 μm submilliamp threshold quantum dot micro-lasers on Si

Heterogeneous silicon photonics sensing for autonomous cars.

Interband cascade laser on silicon

High-Performance O-Band Quantum-Dot Semiconductor Optical Amplifiers Directly Grown on a CMOS Compatible Silicon Substrate

Sub-mA Threshold 1.3 µm CW Lasing from Electrically Pumped Micro-rings Grown on (001) Si