In this paper we evaluate the Reticle Defect Review feature on KLA-Tencor's e-beam review tool, eDR™-7110, and study defect printability of reticle defects on wafer. The RDR feature is able to read KLA-Tencor's reticle inspection results directly without any intermediate format, thus allowing what-you-see-is-what-you-get setup on the wafer review tool. Compared with a conventional reticle to wafer approach using KLA Results Files, Reticle Defect Review provides faster time to results, more accurate defect disposition and increased ease of use, which have been demonstrated by the printability study of reticle defects on a focus exposure matrix wafer.

Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools

Requalifying semiconductor photomasks remains critically important and is increasingly challenging
for 20nm and 14nm node logic reticles. Patterns are becoming more complex on the photomask,
and defect sensitivity requirements are more stringent than ever before. Reticle inspection tools
are equally important for effective process development and the successful ramp and sustained
yield for high volume manufacturing. The inspection stages considered were: incoming inspection
to match with Mask Shop Outgoing result and to detect defects generated during transport;
requalification by routine cycle inspection to detect Haze and any other defects; and inspection by
in-house or Mask shop at the post cleaning. There are many critical capability and capacity factors
for the decision for best inspection tool and strategy for high volume manufacturing, especially
objective Lens NA, wavelength, power, pixel size, throughput, full-automation inspection linked
with Overhead Transport, algorithm application, engineering application function, and inspection
of PSM and OMOG . These tools are expensive but deliver differentiated value in terms of
performance and throughput as well as extendibility. Performing a thorough evaluation and
making a technically sound choice which explores these many factors is critical for success of a
fab. This paper examines the methodology for evaluating two different photomask inspection
tools. The focus is on ensuring production worthiness on real and advanced product photomasks
requiring accurate evaluation of sensitivity, throughput, data analysis function and engineering
work function on those product photomasks. Photomasks used for data collection are production
reticles, PDM(Program defect Mask), SiN spray defect Reticle which is described that evaluates
how the tools would perform on a contaminated plate.

Ashish Mungmode

Papers

Best-practice evaluation-methods for wafer-fab photomask-requalification inspection tools

Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools