B
B. V. Vuchic
Researcher at Argonne National Laboratory
Publications - 10
Citations - 41
B. V. Vuchic is an academic researcher from Argonne National Laboratory. The author has contributed to research in topics: Thin film & Grain boundary. The author has an hindex of 4, co-authored 10 publications receiving 41 citations.
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Journal ArticleDOI
Sputter‐induced grain boundary junctions in YBa2Cu3O7−x thin films on MgO
TL;DR: In this article, a low voltage argon ion sputter technique was used to form grain boundary junctions in YBa2Cu3O7−x thin films on MgO.
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The formation, transport properties and microstructure of 45° [001] grain boundaries induced by epitaxy modification in YBa2Cu3O7-x thin films
B. V. Vuchic,Karl L. Merkle,P. M. Baldo,K. A. Dean,Donald B. Buchholz,Robert P. H. Chang,Hua Zhang,Laurence D. Marks +7 more
TL;DR: In this paper, the same grain boundaries were examined by transmission electron microscopy and high-resolution electron microscope and it was found that the boundaries are for the most part free of precipitates and well structured at the atomic scale.
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YBa2Cu3O7-δ on MgO films grown by pulsed organometallic beam epitaxy and a grain boundary junction application
K. A. Dean,Donald B. Buchholz,Laurence D. Marks,Robert P. H. Chang,B. V. Vuchic,Karl L. Merkle,D. B. Studebaker,Tobin J. Marks +7 more
TL;DR: In this article, a grain boundary junctions were formed by growing YBa{sub 2}Cu{sub 3}O{sub 7{minus-delta}} on MgO films that had been pretreated with a simple sputtering technique.
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YBa/sub 2/Cu/sub 3/O/sub 7-x/ 45/spl deg/ [001] tilt grain boundaries induced by controlled low-energy sputtering of MgO substrates: transport properties and atomic-scale structure
B. V. Vuchic,Karl L. Merkle,J.W. Funkhouser,D. B. Buchholz,K.A. Dean,Robert P. H. Chang,Laurence D. Marks +6 more
TL;DR: In this article, a low energy broad beam argon ion source was used to irradiate a select region of (100) MgO substrates and the grain orientation was rotated 45 degrees about the c-axis with respect to the grain on the unmilled portion.
Journal ArticleDOI
Integrated multilayer sputter‐induced 45° YBa2Cu3O7−x grain boundary junctions
B. V. Vuchic,Karl L. Merkle,K. A. Dean,Donald B. Buchholz,Robert P. H. Chang,Laurence D. Marks +5 more
TL;DR: In this article, a multilayer technique was developed to form 45° YBa2Cu3O7−x [001] tilt grain boundary junctions on LaAlO3 substrates.