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Bai Huang

Researcher at South China University of Technology

Publications -  17
Citations -  526

Bai Huang is an academic researcher from South China University of Technology. The author has contributed to research in topics: Thermal conductivity & Boron nitride. The author has an hindex of 8, co-authored 15 publications receiving 278 citations.

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High through-plane thermal conductivity of polymer based product with vertical alignment of graphite flakes achieved via 3D printing

TL;DR: In this paper, a high thermally conductive property was achieved by using fused deposition modeling (FDM) for 3D printing with graphite flakes vertically aligned in the in-plane direction.
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Effect of nanoparticles on the mechanical properties of acrylonitrile–butadiene–styrene specimens fabricated by fused deposition modeling

TL;DR: In this article, the effects of the nanoparticles on the mechanical strength, anisotropy, and thermal properties of the ABS specimens were evaluated and the performance of the virgin ABS samples manufactured by FDM and injection molding were also studied.
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Shape memory effect of three-dimensional printed products based on polypropylene/nylon 6 alloy

TL;DR: In this article, polypropylene/nylon 6 (PP/PA6) alloy was fabricated as a candidate for FDM and maleic anhydride-grafted poly(ethylene-octene) (POE-g-MAH) was used as a modifying agent as well as a compatibilizer.